Preparation of Ni–P–GO composite coatings and its mechanical properties

H Wu, F Liu, W Gong, F Ye, L Hao, J Jiang… - Surface and Coatings …, 2015 - Elsevier
Ni–P–GO composite coatings were prepared on mild steel through an electroless nickel
bath with homemade graphene oxide (GO). The structure, surface morphology, and …

Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3. 5Ag solders

J Xiao, F Wang, J Li, Z Chen - Applied Surface Science, 2023 - Elsevier
Electroless Ni-P plating has good prospects for application as a diffusion barrier layer for
interfacial reactions. In this study, the interfacial reaction between the microcone-structured …

Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5 Ag lead-free solder with improved joint reliability

Y Yang, JN Balaraju, Y Huang, H Liu, Z Chen - Acta materialia, 2014 - Elsevier
To address the reliability challenges brought about by the accelerated reaction with the
implementation of lead-free solders, an electrolessly plated Ni–Co–P alloy (3–4 wt.% P and …

Improving the mechanical performance of Sn57. 6Bi0. 4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) …

Y Li, K Luo, ABY Lim, Z Chen, F Wu… - Materials Science and …, 2016 - Elsevier
Abstract Sn57. 6Bi0. 4Ag solder has been reinforced successfully through the addition of
tungsten (W) nanoparticles at a concentration of 0.5 wt%. With the addition of W …

Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni–W–P coating

J Cheng, X Hu, S Li - Journal of Materials Science: Materials in Electronics, 2020 - Springer
Abstract The SAC305/Ni–W–P/Cu joint system has been investigated in previous studies,
and Ni–W–P barrier was suggested to be efficient to inhibit excessive diffusion of atoms …

Three-dimensional visualization of the crack-growth behavior of nano-silver joints during shear creep

Y Tan, X Li, G Chen, Y Mei, X Chen - Journal of Electronic Materials, 2015 - Springer
Evolution of creep damage in nano-silver sintered lap shear joints was investigated at 325°
C. Non-destructive x-ray three-dimensional (3D) visualization clearly revealed the crack …

Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection

X Hu, S Xu, Y Yang, Z Chen, YC Chan - Materials Science and …, 2014 - Elsevier
One primary purpose of this study is to introduce an electroless Ni–P–TiO 2 (17.5 at% of P)
composite coating as a pad finish for advanced electronic packaging. In this study, TiO 2 …

Competitive deposition of electroless Ni–W–P coatings on mild steel via a dual-complexant plating bath composed of sodium citrate and lactic acid

J Li, D Wang, H Cai, A Wang, J Zhang - Surface and Coatings Technology, 2015 - Elsevier
Based on the fact that the deposition reactions for electroless Ni–W–P coatings depend on
the participation of H 2 PO 2−, we developed a competitive deposition process that H 2 PO …

Effect of sodium stannate on low temperature electroless Ni− Sn− P deposition and the study of its mechanism

Y Wang, R Tang, C Yang, T Xu, N Mitsuzaki, Z Chen - Thin Solid Films, 2019 - Elsevier
In this study, the ternary Ni− Sn− P alloy coatings were prepared on the copper substrate by
electroless deposition at a relatively low temperature of 50° C with a relatively high …

Preparation and characterization of conductive and corrosion-resistant wood-based composite by electroless Ni–W–P plating on birch veneer

C Shi, Z Tang, L Wang, L Wang - Wood Science and Technology, 2017 - Springer
A conductive and corrosion-resistant wood-based composite was obtained via electroless Ni–
W–P plating on birch veneers. The W content of the Ni–W–P coatings obtained under …