This paper presents a new method for wafer-level hermetic packaging of MEMS devices
using a relatively low temperature anodic bonding technique applied to the recently …

This paper reports a novel and inherently simple fabrication process, so-called advanced
MEMS (aMEMS) process, that is developed for high-yield and reliable manufacturing of …

In this work, SiNx/a-Si/SiNx caps on conductive coplanar waveguides (CPWs) are proposed
for thin film encapsulation of radio-frequency microelectromechanical systems (RF MEMS) …

Thispaper introduces a novel, inherently simple, and all-silicon wafer-level fabrication and
hermetic packaging method developed for MEMS devices. The proposed method uses two …

Computational modeling is often leveraged to design and optimize electronic packages for
both performance and reliability purposes. One of the factors that affect the accuracy of …

This paper presents buckled nitride thin-film encapsulation using anti-adhesion layer-
assisted transfer technique and benzocyclobutene (BCB)/nitride bilayer wrinkling due to …

Thin-film encapsulation (TFE) is one of the promising wafer-level packaging techniques for
microelectromechanical systems (MEMS) devices. One of the drawbacks of TFE is that it is …

Here the integration of a tube-shaped Pirani gauge with a SiN thin-film encapsulation
process is presented. The tube geometry gives the sensor a very low detection limit with a …

The sealed cavity pressure of a micro-package often becomes the determining factor of the
performance of an encapsulated micro-electro mechanical system (MEMS). In this study, a …

This paper presents a 3D direct numerical simulation of buckled thin-film packaging based
on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode …