Photonics die or integrated photonics modules co-packaged with compute engines have the
potential to deliver significant improvements in power, bandwidth and reach needed to meet …

Integrating photonics with advanced electronics leverages transistor performance, process
fidelity and package integration, to enable a new class of systems-on-a-chip for a variety of …

In this paper, we present a brief history of silicon photonics from the early research papers in
the late 1980s and early 1990s, to the potentially revolutionary technology that exists today …

A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect
transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude modulation (4 …

Optical receivers (ORXs) with integrated CMOS electronics enable compact, low-power
solutions for 400-G Ethernet and co-packaged optics. In this article, we present a 100-Gb/s …

This article presents the first experimental demonstration of an energy-efficient electronic-
photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high …

Since the CMOS technology scaling has focused on improving digital circuit, the design of
conventional analog circuits has become more and more difficult. To overcome this …

Convolution neural network (CNN), as one of the most powerful and popular technologies,
has achieved remarkable progress for image and video classification since its invention …

The field of topological photonics has seen tremendous and wide‐ranging developments in
recent years. Evolving from the broader field of topological insulators, topological photonics …

Chiplet-based systems have recently received much attention for scaling-up processing
power in HPC systems due to their high energy efficiency and low cost manufacturing; …