Atomically precise manufacturing of silicon electronics

J Pitters, J Croshaw, R Achal, L Livadaru, S Ng… - ACS …, 2024 - ACS Publications
Atomically precise manufacturing (APM) is a key technique that involves the direct control of
atoms in order to manufacture products or components of products. It has been developed …

Hexagons are the bestagons: design automation for silicon dangling bond logic

M Walter, SSH Ng, K Walus, R Wille - Proceedings of the 59th ACM/IEEE …, 2022 - dl.acm.org
Field-coupled Nanocomputing (FCN) defines a class of post-CMOS nanotechnologies that
promises compact layouts, low power operation, and high clock rates. Recent breakthroughs …

Scalable Physical Design for Silicon Dangling Bond Logic: How a 45° Turn Prevents the Reinvention of the Wheel

S Hofmann, M Walter, R Wille - 2023 IEEE 23rd International …, 2023 - ieeexplore.ieee.org
With the ever-increasing demands of computing, post-CMOS technologies are sought after.
Field-coupled Nanocomputing (FCN), which relies on physical field repulsion, is a class of …

The Need for Speed: Efficient Exact Simulation of Silicon Dangling Bond Logic

J Drewniok, M Walter, R Wille - 2024 29th Asia and South …, 2024 - ieeexplore.ieee.org
The Silicon Dangling Bond (SiDB) logic platform, an emerging computational beyond-CMOS
nanotechnology, is a promising competitor due to its ability to achieve integration density …

QuickSim: Efficient and Accurate Physical Simulation of Silicon Dangling Bond Logic

J Drewniok, M Walter, SSH Ng… - 2023 IEEE 23rd …, 2023 - ieeexplore.ieee.org
Silicon Dangling Bonds have established themselves as a promising competitor in the field
of beyond-CMOS technologies. Their integration density and potential for energy dissipation …

Temperature Behavior of Silicon Dangling Bond Logic

J Drewniok, M Walter, R Wille - 2023 IEEE 23rd International …, 2023 - ieeexplore.ieee.org
Silicon Dangling Bonds (SiDBs) on the hydrogen-passivated silicon surface have emerged
as a promising competitor in the realm of beyond-CMOS computational technologies. They …

[PDF][PDF] The Munich Nanotech Toolkit (MNT)

M Walter, J Drewniok, S Hofmann, B Hien, R Wille - 2024 - cda.cit.tum.de
As traditional computing technologies near their physical limits, the demand for beyond-
CMOS alternatives intensifies. Among these, Field-coupled Nanocomputing (FCN) emerges …

Post-Layout Optimization for Field-coupled Nanotechnologies

ST Hofmann, M Walter, R Wille - Proceedings of the 18th ACM …, 2023 - dl.acm.org
While conventional computing technologies reach their limits, the demand for computation
power keeps growing, fueling the interest in post-CMOS technologies. One promising …

Atomic Defect-Aware Physical Design of Silicon Dangling Bond Logic on the H-Si (100) 2x1 Surface

M Walter, J Croshaw, SSH Ng, K Walus… - arXiv preprint arXiv …, 2023 - arxiv.org
Although fabrication capabilities of Silicon Dangling Bonds have rapidly advanced from
manual labor-driven laboratory work to automated manufacturing in just recent years, sub …

Versatile Signal Distribution Networks for Scalable Placement and Routing of Field-coupled Nanocomputing Technologies

M Walter, B Hien, R Wille - 2023 IEEE Computer Society Annual …, 2023 - ieeexplore.ieee.org
Field-coupled Nanocomputing (FCN) is a promising beyond-CMOS technology that
leverages physical field repulsion instead of electrical current flow to transmit information …