The electronic equipment developing towards miniaturization and high integration is facing
the danger of high heat flux and non-uniform temperature distribution which leads to the …

This paper presents a review of literature on the effects of using nanofluids (NFs) in energy
systems. First, different types of NFs, including the combination of metal and non-metal …

Recent technological advancements have led to a drastic increase in heat flux dissipation,
which is a prime factor for lower efficiency and permanent failure. Therefore, cooling …

The cooling or thermal management issues are facing critical challenges with the
continuous miniaturization and rapid increase of heat flux of electronic devices. Significant …

Efficient thermal management in electric devices is highly essential for ensuring the
reliability and durability of electronics. This study aims to investigate the thermal …

As demand for high-performance heat transfer increases, interest in microchannel heat sinks
as a viable solution for heat flux removal in thermal devices has grown significantly …

With the high miniaturization and integration of micro-electro-mechanical systems, micro-
satellite, lasers, and high-voltage electrical appliances, the heat transfer of electronic …

This paper investigates the advantages and challenges associated with two-phase flows,
specifically flow boiling of pure liquids and nanofluids, for cooling applications in …

The present trend of miniaturization in various electronic devices has caused higher heat
generation per unit area. Dissipation of highly concentrated heat from these devices is …

Abstract The Topology Optimization (TO) has been proved to be an effective method for
designing Microchannel Heat Sinks (MCHS). However, due to the relatively high …