Transmission laser welding of similar and dissimilar semiconductor materials
Laser micro‐welding is an advanced manufacturing method today applied in various
domains. However, important physical limitations have prevented so far to demonstrate its …
domains. However, important physical limitations have prevented so far to demonstrate its …
[HTML][HTML] Microchannel cooling for the LHCb VELO Upgrade I
OA de Aguiar Francisco, W Byczynski, K Akiba… - Nuclear Instruments and …, 2022 - Elsevier
Abstract The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run
3, uses silicon microchannel coolers with internally circulating bi-phase CO 2 for thermal …
3, uses silicon microchannel coolers with internally circulating bi-phase CO 2 for thermal …
Internal Structuring of Semiconductors with Ultrafast Lasers: Opening a Route to Three-Dimensional Silicon Photonics
D Grojo, M Chambonneau, S Lei… - … : The Pursuit of Extreme …, 2023 - Springer
Important challenges remain to achieve reliable three-dimensional laser writing inside
semiconductors as important as silicon. Experiments show that nonlinear energy deposition …
semiconductors as important as silicon. Experiments show that nonlinear energy deposition …
[PDF][PDF] Short-pulse laser processing of Silicon: towards all laser-made devices
A Mouskeftaras, P Sopeña, A Wang, S Beurthey… - Lasers in …, 2023 - hal.science
Silicon is among the most important technological materials with extensive uses in the fields
of microelectronics, microfluidics and micromechanics. Fabrication of the different silicon …
of microelectronics, microfluidics and micromechanics. Fabrication of the different silicon …
[HTML][HTML] Investigation of the Contact Characteristics of Silicon–Gold in an Anodic Bonding Structure
L Zhang, K Cao, L Ran, H Yu, W Zhou - Micromachines, 2022 - mdpi.com
Anodic bonding is broadly utilized to realize the structure support and electrical connection
in the process of fabrication and packaging of MEMS devices, and the mechanical and …
in the process of fabrication and packaging of MEMS devices, and the mechanical and …