A review of mechanical properties of lead-free solders for electronic packaging
H Ma, JC Suhling - Journal of materials science, 2009 - Springer
The characterization of lead-free solders, especially after isothermal aging, is very important
in order to accurately predict the reliability of solder joints. However, due to lack of …
in order to accurately predict the reliability of solder joints. However, due to lack of …
Numerical analysis and simulation of plasticity
JC Simo - Handbook of numerical analysis, 1998 - Elsevier
Efforts aimed at understanding the behavior of metals under loading beyond the elastic
regime provided the starting point, at the turn of this century, for the development of a body of …
regime provided the starting point, at the turn of this century, for the development of a body of …
Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method
The stress–strain response of sintered silver nanoparticles (AgNP) materials is precisely
characterized in order to adapt for numerical analysis and rational design of electronic …
characterized in order to adapt for numerical analysis and rational design of electronic …
Crystallographic texture evolution in bulk deformation processing of FCC metals
A Taylor-type polycrystalline model, together with a new fully-implicit time-integration
scheme has been developed and implemented in a finite element program to simulate the …
scheme has been developed and implemented in a finite element program to simulate the …
[PDF][PDF] Printed circuits handbook
CF Coombs - 2001 - ir.juit.ac.in
With the implementation of the European Union (EU) directive on Restriction of Hazardous
Substances (RoHS), the printed circuit industry has been forced to undergo a revolution in …
Substances (RoHS), the printed circuit industry has been forced to undergo a revolution in …
An internal variable constitutive model for hot working of metals
A set of internal variable type constitutive equations which model large elastic-viscoplastic
deformations of metals at high temperatures is formulated. For a first-order representation of …
deformations of metals at high temperatures is formulated. For a first-order representation of …
Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction
R Darveaux - J. Electron. Packag., 2002 - asmedigitalcollection.asme.org
A generalized solder joint fatigue life model for surface mount packages was previously
published in [1, 2]. The model is based on correlation to measured crack growth data on …
published in [1, 2]. The model is based on correlation to measured crack growth data on …
[HTML][HTML] A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
This paper presents a multi-scale modelling approach to investigate the underpinning
mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5 Cu (wt …
mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5 Cu (wt …
A constitutive model for transformation plasticity accompanying strain-induced martensitic transformations in metastable austenitic steels
RG Stringfellow, DM Parks, GB Olson - Acta metallurgica et materialia, 1992 - Elsevier
We propose a constitutive model which describes the transformation plasticity
accompanying strain-induced martensitic transformation in nonthermoelastic alloys. The …
accompanying strain-induced martensitic transformation in nonthermoelastic alloys. The …
A plastic constitutive equation incorporating strain, strain-rate, and temperature
JH Sung, JH Kim, RH Wagoner - International Journal of Plasticity, 2010 - Elsevier
An empirical plasticity constitutive form describing the flow stress as a function of strain,
strain-rate, and temperature has been developed, fit to data for three dual-phase (DP) steels …
strain-rate, and temperature has been developed, fit to data for three dual-phase (DP) steels …