A review of mechanical properties of lead-free solders for electronic packaging

H Ma, JC Suhling - Journal of materials science, 2009 - Springer
The characterization of lead-free solders, especially after isothermal aging, is very important
in order to accurately predict the reliability of solder joints. However, due to lack of …

Numerical analysis and simulation of plasticity

JC Simo - Handbook of numerical analysis, 1998 - Elsevier
Efforts aimed at understanding the behavior of metals under loading beyond the elastic
regime provided the starting point, at the turn of this century, for the development of a body of …

Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method

X Long, K Chong, Y Su, L Du, G Zhang - Engineering Fracture Mechanics, 2023 - Elsevier
The stress–strain response of sintered silver nanoparticles (AgNP) materials is precisely
characterized in order to adapt for numerical analysis and rational design of electronic …

Crystallographic texture evolution in bulk deformation processing of FCC metals

SR Kalidindi, CA Bronkhorst, L Anand - … of the Mechanics and Physics of …, 1992 - Elsevier
A Taylor-type polycrystalline model, together with a new fully-implicit time-integration
scheme has been developed and implemented in a finite element program to simulate the …

[PDF][PDF] Printed circuits handbook

CF Coombs - 2001 - ir.juit.ac.in
With the implementation of the European Union (EU) directive on Restriction of Hazardous
Substances (RoHS), the printed circuit industry has been forced to undergo a revolution in …

An internal variable constitutive model for hot working of metals

SB Brown, KH Kim, L Anand - International journal of plasticity, 1989 - Elsevier
A set of internal variable type constitutive equations which model large elastic-viscoplastic
deformations of metals at high temperatures is formulated. For a first-order representation of …

Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction

R Darveaux - J. Electron. Packag., 2002 - asmedigitalcollection.asme.org
A generalized solder joint fatigue life model for surface mount packages was previously
published in [1, 2]. The model is based on correlation to measured crack growth data on …

[HTML][HTML] A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

Y Xu, J Xian, S Stoyanov, C Bailey, RJ Coyle… - International Journal of …, 2022 - Elsevier
This paper presents a multi-scale modelling approach to investigate the underpinning
mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5 Cu (wt …

A constitutive model for transformation plasticity accompanying strain-induced martensitic transformations in metastable austenitic steels

RG Stringfellow, DM Parks, GB Olson - Acta metallurgica et materialia, 1992 - Elsevier
We propose a constitutive model which describes the transformation plasticity
accompanying strain-induced martensitic transformation in nonthermoelastic alloys. The …

A plastic constitutive equation incorporating strain, strain-rate, and temperature

JH Sung, JH Kim, RH Wagoner - International Journal of Plasticity, 2010 - Elsevier
An empirical plasticity constitutive form describing the flow stress as a function of strain,
strain-rate, and temperature has been developed, fit to data for three dual-phase (DP) steels …