The present disclosure relates generally to microphones and related components. One
example micro electro mechanical system (MEMS) motor includes a first diaphragm; a …

According to embodiment, a transducer includes a microfabricated element integrated on a
single die and an interface IC coupled to the microfabricated element. The microfabricated …

A MEMS microphone and a method for manufacturing a MEMS microphone are disclosed.
Embodiments of the invention provide a MEMS microphone including a MEMS microphone …

(57) ABSTRACT A MEMS device includes a first plate coupled to a second plate and a fixed
third plate formed on a first substrate. The first and second plates are displaced in the …

(57) ABSTRACT A MEMS microphone includes a substrate, and a first conversion portion
and a second conversion portion pro vided on the substrate, the first conversion portion and …

A capacitive microphone may include a housing, a membrane, and a first backplate, wherein
a first insulating layer may be disposed on a first side of the first backplate facing the …

A microphone assembly and a method for manufacturing a microphone assembly are
disclosed. In an embodiment, the microphone assembly includes a MEMS dual backplate …

A semiconductor device is proposed. The semiconductor device comprises a membrane
structure having an opening. Furthermore, the semiconductor device comprises a first …

A MEMS microphone includes a substrate, and a first conversion portion and a second
conversion portion provided on the substrate, the first conversion portion and the second …

A microphone and its manufacturing method, relating the semiconductor techniques, are
presented. The microphone comprises: a substrate comprising an opening, a first elec trode …