Fracture toughness, a parameter representing the resistance to fracture and capacity of a
material to absorb impact force or energy, is one of the key performance indicators that need …

Recently, boron nitride (BN) based materials have received significant attention in both
academic and industrial sectors due to its interesting properties like large energy band gap …

In the field of modern microelectronic packaging materials, there is a great need for polymer-
based composites with both excellent thermal conduction and flame retardancy properties …

Polymer composites are widely used in microelectronics and wireless communication,
wherein high thermal conductivity and low dielectric loss are highly pursued for efficient heat …

Because of their large latent heat, phase change material (PCM) composites have received
much attention for thermal energy storage and heat management applications. However, the …

Polypropylene (PP) is a versatile polymer with numerous applications that has undergone
substantial changes in recent years, focusing on the demand for next-generation polymers …

Due to special non‐metallic polar bond between the III group (with certain metallic
properties) element boron (B) and the V group element nitrogen (N), boron nitride (BN) has …

Owing to the rapid development of the latest micro-electronic devices, polymer composite
materials that combine high thermal conductivity and low permittivity have aroused the …

Improving thermal properties of polymer-based composites by using different types of fillers
most of the time also reduces material elasticity and flexural strength, which is a significant …

Various fillers and methods have been utilized to enhance the thermal conductivity (TC) of
polymer-based electronic packaging materials, however, the enhancement was limited by …