Atomic and close-to-atomic scale manufacturing is a new technology that can achieve
atomic-level manufacturing precision and functional critical dimension. Here we propose an …

Molybdenum (Mo) is a promising metal contact material to replace tungsten due to its low
electrical resistivity in sub-3 nm next-generation semiconductor processes. However, the …

Copper (Cu) has been an interconnect material widely used in giant-large scale integrated
circuits (GLSI). Corrosion inhibitor is a key factor to ensure global planarization of Cu in the …

Several new possible biobased corrosion inhibitors derived from fatty hydrazide derivatives
were analyzed using quantum chemical calculations via the density functional theory …

Topography of tungsten should be assured at a minimum through chemical mechanical
planarization (CMP) in the metal gate structures (eg, buried gates, replacement metal gates) …

We systematically investigate the adsorption behavior and corrosion inhibition efficacy of
pyridine carboxylic acid isomers (Picolinic, Nicotinic, Isonicotinic acids) on Cu films in …

Aliphatic amino acids (AAs) were investigated as environmentally friendly alternatives to
benzotriazole (BTA) in the chemical mechanical planarization (CMP) process for Cu …

Chemical mechanical planarization (CMP) is receiving a growing interest in the fabrication
of phase change memory in order to achieve a highly scaled confined cell structure and …

The increasing global demand for Mn necessitates cost-effective recovery methods
applicable to low-and medium-grade ores. Reductive bioleaching has emerged as a …

Magnetoelastic (ME) resonance devices are attractive for application as biosensors in health-
related areas as they allow contactless detection of pathogenic agents with high sensitivity …