Evolutions of material flow and intermetallic compounds, and the correlations with mechanical properties of dissimilar Al/Cu friction stir welding joints

H Su, Q Zhao, J Chen, C Wu - Journal of Materials Science, 2022 - Springer
In the present paper, the evolutions of material flow and intermetallic compounds (IMCs)
during friction stir welding (FSW) of dissimilar Al/Cu with two different plate positions are …

Interface evolution and strengthening of two-step roll bonded copper/aluminum clad composites

W Wang, H Wang, X Liu, Z Liu - Materials Characterization, 2023 - Elsevier
The laminated metal composite plate has drawn great focus in view of its advantages of high
performance. In this study, a two-step roll bonded Cu/Al clad composites was developed …

A revew of in situ transmission electron microscopy study on the switching mechanism and packaging reliability in non-volatile memory

X Yang, C Luo, X Tian, F Liang, Y Xia… - Journal of …, 2021 - iopscience.iop.org
Non-volatile memory (NVM) devices with non-volatility and low power consumption
properties are important in the data storage field. The switching mechanism and packaging …

Cu-Al interfacial formation and kinetic growth behavior during HTS reliability test

CP Liu, SJ Chang, YF Liu, WS Chen - Journal of Materials Processing …, 2019 - Elsevier
Reverse engineering techniques of Cu wire bonding process used in manufacturing
microelectronic packing components are proposed for evaluating Cu-Al intermetallic …

Corrosion-induced degradation and its mechanism study of Cu–Al interface for Cu-wire bonding under HAST conditions

CP Liu, SJ Chang, YF Liu, J Su - Journal of Alloys and Compounds, 2020 - Elsevier
This study explores the Cu wire corrosion-related issues and provides solutions for
evaluation & analysis as the Automotive Electronics Council (AEC) continually formulates …

Influence of diffusion brazing parameters on microstructure and properties of Cu/Al joints

XG Wang, XG Li, CG Wang - Journal of Manufacturing Processes, 2018 - Elsevier
The purpose of this article was to produce a sound Cu/Al joint by controlling interfacial inter-
metallic compounds (IMCs) using suitable diffusion brazing parameter. An Al-8Si-4Cu-2Mg …

Solid-State Diffusion Welding of Commercial Aluminum Alloy with Pure Copper: Welding of Aluminum Alloy to Copper

W Bedjaoui, Z Boumerzoug… - International Journal of …, 2022 - journal.ump.edu.my
The aim of this investigation is to study the effect of time and temperature on the solid-state
diffusion welding of commercial aluminum alloy 2xxx series with a pure copper at 425 C …

Investigation of the early stage of reactive interdiffusion in the Cu-Al system by in-situ transmission electron microscopy

F Moisy, X Sauvage, E Hug - Materialia, 2020 - Elsevier
The early stage of the reactive interdiffusion in the Cu-Al system was investigated at 350° C
and 300° C thanks to in-situ transmission electron microscopy. A special care was given to …

Grain size stabilization and strengthening of cryomilled nanostructured Cu 12 at% Al alloy

S Chakravarty, K Sikdar, SS Singh, D Roy… - Journal of Alloys and …, 2017 - Elsevier
Abstract Nanocrystalline Cu12 at% Al alloy was synthesized by high energy ball milling
under cryogenic condition. The alloy was then annealed up to 900° C (or 0.87 T m). Phase …

Interfacial structure and properties of Cu/Al joints brazed with Zn-Al filler metals

Z Niu, Z Ye, J Huang, H Yang, J Yang, S Chen - Materials Characterization, 2018 - Elsevier
Seeing that opinions vary, no unanimous conclusion has been drawn on Cu side interfacial
structure and its relationship with the mechanical properties of Cu/Al joints brazed with Zn-Al …