The objective of this review is to study the evolution and key findings and critical technical
challenges, solutions and future trend of bonding wires used in semiconductor electronics …

The bonding mechanisms of gold, to give the desired strength of wire bonding, still require
detailed investigation, including establishing adequate and reliable testing procedures. The …

The interfacial microstructures of the Cu-wire bonding to an Al pad are investigated first by
using an X-ray microdiffractometer and high-resolution transmission electron microscopy. It …

In this paper, three Pd-coated Cu (PCC) wires with different Pd-layer thicknesses were used
to make bonding samples, and the influence of Pd-layer thickness on the reliability of …

Microstructure characteristics of Cu-wire bonding interface are investigated first by using the
X-ray microdiffractometer, and the dynamic process of Cu-and Au-wire overhang bonding is …

Purpose–The purpose of this paper is to provide a systematic review on technical findings
and discuss the feasibility and future of gold (Au) wirebonding in microelectronics …

Cu wire is replacing Au wire in the microelectronic industry due to its lower cost. However,
during Cu ball bonding one of the main challenges is the increased stress that can damage …

Abstract In this work PeakForce Kelvin Probe Force Microscopy (PF-KPFM) at ambient
environment is used to characterize both oxidation states of copper (Cu) surfaces, cupric …

The effect of ultrasonic vibration on nanoscale interfacial structure of thermosonic copper
wire bonding on aluminium pads was investigated. It was found that bonding strength was …

The aim of this study is to identify the bonding mechanisms of the ultrasonic Al bond on the
Mo back-contact layer (Al-Mo system) of a copper indium gallium (de) selenide (CIGS) thin …