Inkjet printed dielectrics for electronic packaging of chip embedding modules
M Mengel, I Nikitin - Microelectronic Engineering, 2010 - Elsevier
The inkjet printing of a dielectric layer as part of an assembling process for a semiconductor
device was evaluated. This layer embeds a chip so that a space-saving package with …
device was evaluated. This layer embeds a chip so that a space-saving package with …
Stability of aqueous barium titanate suspensions for MLCC inkjet printing
E Beaudrouet, A Vivet, M Lejeune… - Journal of the …, 2014 - Wiley Online Library
BaTiO 3‐based materials are currently used for the fabrication of multilayer ceramic
capacitors (MLCC) because of their high dielectric properties. The inkjet printing (IJP) …
capacitors (MLCC) because of their high dielectric properties. The inkjet printing (IJP) …
Application of wide-band material characterization methods to printable electronics
VJ Pynttäri, RM Mäkinen, VK Palukuru… - IEEE transactions on …, 2010 - ieeexplore.ieee.org
In this paper, characterization methods are presented with results from test structures printed
with varying printing parameters and materials. It is shown that different process parameters …
with varying printing parameters and materials. It is shown that different process parameters …
Threshold voltage instability in organic TFT with SiO2 and SiO2/parylene-stack dielectrics
N Wrachien, A Cester, A Pinato… - 2009 IEEE …, 2009 - ieeexplore.ieee.org
We study the charge trapping/detrapping kinetics on pentacene-based organic thin-film-
transistors featuring SiO 2 and SiO 2/parylene C stack gate insulators. The threshold voltage …
transistors featuring SiO 2 and SiO 2/parylene C stack gate insulators. The threshold voltage …