The effect of micro-alloying and surface finishes on the thermal cycling reliability of doped SAC solder alloys
The surface finish (SF) becomes a part of the solder joint during assembly and improves the
component's reliability. Furthermore, the SF influences the solder joint's reliability by …
component's reliability. Furthermore, the SF influences the solder joint's reliability by …
Effective solder for improved thermo-mechanical reliability of solder joints in a ball grid array (BGA) soldered on printed circuit board (PCB)
Ball grid array (BGA) packages have increasing applications in mobile phones, disk drives,
LC displays and automotive engine controllers. However, the thermo-mechanical reliability …
LC displays and automotive engine controllers. However, the thermo-mechanical reliability …
The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder
Lead free solder materials are widely used in electronic packaging industry due to
environmental concerns. However, experimental testing and microstructural characterization …
environmental concerns. However, experimental testing and microstructural characterization …
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging
The effects of aging on the cyclic shear stress–strain and fatigue behavior of lead-free
solders have been explored experimentally and have been presented in this paper. An …
solders have been explored experimentally and have been presented in this paper. An …
The effects of aging on the fatigue life of lead free solders
Solder joints in electronic assemblies are typically subjected to thermal cycling, either in
actual application or in accelerated life testing used for qualification. Mismatches in the …
actual application or in accelerated life testing used for qualification. Mismatches in the …
Assembly options and challenges for electronic products with lead-free exemption
Due to safety and reliability concerns, various classes and/or applications of electronic
products are excluded from the European Union's Restriction of Hazardous Substances …
products are excluded from the European Union's Restriction of Hazardous Substances …
Thermal cycling reliability of aged PBGA assemblies-comparison of Weibull failure data and finite element model predictions
Isothermal aging causes detrimental changes in the microstructure, mechanical response,
and failure behavior of lead free solder joints in electronic assemblies. These material …
and failure behavior of lead free solder joints in electronic assemblies. These material …
[PDF][PDF] Long term aging effects on the reliability of lead free solder joints in ball grid array packages with various pitch sizes and ball alignments
This paper investigates the impact of isothermal aging on the long-term reliability of lead-
free solder joints. The full experimental matrix contains SAC105 and SAC305 solder alloys …
free solder joints. The full experimental matrix contains SAC105 and SAC305 solder alloys …
Mechanical characterization of doped SAC solder materials at high temperature
Reliable lead free solders are needed for products exposed to extreme environments such
as those used in the automotive, avionics, and oil-exploration industries, as well as in …
as those used in the automotive, avionics, and oil-exploration industries, as well as in …
Visualization of microstructural evolution in lead free solders during isothermal aging using time-lapse imagery
N Fu, S Ahmed, JC Suhling… - 2017 IEEE 67th Electronic …, 2017 - ieeexplore.ieee.org
In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy
(SPM) have been utilized to examine aging induced microstructural changes occurring …
(SPM) have been utilized to examine aging induced microstructural changes occurring …