During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Abstract Large Ag 3 Sn plates in solder joints can affect the reliability of electronics,
however, the factors affecting their nucleation and morphology are not well understood …

We investigate the coarsening dynamics of the three-phase eutectic Al-Ag 2 Al-Al 2 Cu at
723 K via in situ transmission X-ray nano-tomography. Unlike previous investigations that …

Thermal fatigue is a common failure mode in electronic solder joints, yet the role of
microstructure is incompletely understood. Here, we quantify the evolution of microstructure …

This research investigated the effects of rapid thermal shock cycle on the internal cracks,
microstructure and internal cracks of SAC305 ball by applying non-destructive high energy …

In 3D packaging memory devices, solder joints are critical links between the chip and the
printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to …

Herein, the microstructure evolution, crack initiation and propagation, and β-Sn
recrystallization behavior of nano-intermetallic compound (nano-IMC)-mixed solder joints …

Cu 6 Sn 5 is the most prominent intermetallic developing eg in solder joints between a Cu-
based conductor material and a Sn-based solder. Mechanical reliability issues connected …

In this paper, the nanoindentation method was used to study the creep properties of nano-
intermetallic compound (nano-IMC) mixed solder joints. Furthermore, the microstructure …

The Aerospace & Defense (A & D) industries maintain a high level of interest in the
expansive amount of work performed in developing and qualifying Pb-free solder alloys. The …