Microprocessor design has recently encountered many constraints such as power, energy,
reliability, and temperature. Among these challenging issues, temperature-related issues …

现场可编程门阵列(Field Programmable Gate Array, FPGA) 作为一种可编程逻辑器件,
在短短二十多年里从电子设计的外围器件逐渐演变为数字系统的核心, 在计算机硬件, 通信 …

In the modern era, artificial intelligence (AI) and deep learning (DL) seamlessly integrate into
various spheres of our daily lives. These cutting-edge disciplines have given rise to …

The creation of facial range models by 3D imaging systems has led to extensive work on 3D
face recognition [19]. However, little work has been done to study the usefulness of such …

In deep submicron circuits, elevation in temperatures has brought new challenges in
reliability, timing, performance, cooling costs and leakage power. Conventional thermal …

Architectural power modeling tools are widely used by the computer architecture community
for rapid evaluations of high-level design choices and design space explorations. Currently …

Thermal hot spots and high temperature gradients degrade reliability and performance, and
increase cooling costs and leakage power. In this paper, we explore the benefits of …

Preventing silicon chips from negative, even disastrous thermal hazards has become
increasingly challenging these days; considering thermal effects early in the design cycle is …

Chip multiprocessor (CMP) techniques have been implemented in embedded systems due
to tremendous computation requirements. Three-dimension (3D) CMP architecture has been …

With large-scale integration and increasing power densities, thermal management has
become an important tool to maintain performance and reliability in modern process …