In the last decade, active devices, such as synthetic jets have been intensively studied for
electronics cooling. The present study experimentally and computationally investigates heat …

Thermal management technology plays a key role in the continuing miniaturization,
performance improvements, and higher reliability of electronic systems. For the past decade …

Air-cooled heat sinks are widely used for microelectronics cooling. Piezoelectrically-driven
agitators and synthetic jets (syn-jets) have been reported as good options in enhancing heat …

Compared to traditional continuous jets, synthetic jets (jets with oscillatory flow such that the
time-average velocity is zero) have specific advantages, such as lower power requirement …

Heat transfer in air-cooled heat sinks must be improved to meet thermal management
requirements of modern microelectronics devices. This need is addressed by putting agitator …

An advanced air cooling scheme that combines both active and passive cooling
components is proposed and its thermal performance is demonstrated with single channel …

With the intent of enhancing heat transfer, agitation of air flow is produced inside a high-
aspect-ratio rectangular channel by means of a translationally oscillating plate. So that the …

From the dawn of the Information Age thermal management technology has played a key
role in the continuing miniaturization, performance improvements, and higher reliability of …

This paper investigates the heat transfer characteristics of a channel system consisting of a
finned heat sink and two piezoelectric devices, the piezoelectric fan (PF) and the …

This paper focuses on the thermal challenges in three-dimensional (3D) chip stacking,
which is poised to become the next packaging paradigm in the electronic industry. While this …