While 3-D integrated circuits (ICs) offer many advantages over 2-D ICs, thermal
management challenges remain unresolved. Thermal through-silicon-vias (TTSVs) are …

High temperature or temperature nonuniformity has been considered as one of the most
challenging problems in three-dimensional integrated circuits (3-D ICs). There have been …

In this study, a new tier partitioning algorithm for three‐dimensional integrated circuits (3D
ICs) using a genetic algorithm (GA) is presented. Design parameters for the proposed 3D IC …

Tier partitioning is one of the most critical stages in monolithic 3-D (M3D) integrated circuits
(ICs) implementation flows. It transforms 2-D netlists into 3-D by performing tier assignment …

Several research works have been undergone in the 3D IC floor planning concepts due to
its higher demand and technological improvement. Floor planning is a complex step when …

In 3-D integrated circuits (3-D ICs), through silicon via (TSV) is a critical technique to provide
vertical connections. However, the yield and reliability challenge of TSV in industry is one of …

ABSTRACT 3D integrated circuits (3D-ICs) is an emerging technology with lots of potential.
3D-ICs enjoy small footprint area and vertical interconnections between different dies which …

In the integrated circuit (IC) designing floorplanning is an important phase in the process of
obtaining the layout of the circuit to be designed. The floorplanning determines the …

The concept of 3D chip stacks has been advocated by both industry and academia for many
years, and hailed as one of the most promising approaches to meet ever-increasing …

A paradigm shift has been witnessed in microelectronic industry in recent days with more
and more research works focusing on transformation of Integrated Circuits from 2 to 3D …