Thermal conductivity of polymers and their nanocomposites

X Xu, J Chen, J Zhou, B Li - Advanced Materials, 2018 - Wiley Online Library
Polymers are usually considered as thermal insulators, and their applications are limited by
their low thermal conductivity. However, recent studies have shown that certain polymers …

The importance of rheological behavior in the additive manufacturing technique material extrusion

ME Mackay - Journal of Rheology, 2018 - pubs.aip.org
Material extrusion (ME), sometimes called Fused Deposition Modeling® or Fused Filament
Fabrication, is an additive manufacturing technique that places order 300 μm diameter …

Solar–thermal water evaporation: a review

Y Pang, J Zhang, R Ma, Z Qu, E Lee, T Luo - ACS Energy Letters, 2020 - ACS Publications
Solar–thermal water evaporation (SWE) has received much interest in recent years due to a
few seminal works on materials innovation and thermal management. With many studies …

Liquid metal composites with enhanced thermal conductivity and stability using molecular thermal linker

H Wang, W Xing, S Chen, C Song… - Advanced …, 2021 - Wiley Online Library
Gallium‐based liquid metal (LM) composite with metallic fillers is an emerging class of
thermal interface materials (TIMs), which are widely applied in electronics and power …

A review of the interfacial characteristics of polymer nanocomposites containing carbon nanotubes

J Chen, B Liu, X Gao, D Xu - RSC advances, 2018 - pubs.rsc.org
This paper provides an overview of recent advances in research on the interfacial
characteristics of carbon nanotube–polymer nanocomposites. The state of knowledge about …

Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles

C Chen, Y Xue, Z Li, Y Wen, X Li, F Wu, X Li… - Chemical Engineering …, 2019 - Elsevier
Polymer-based thermal conductive composites (PTCs) with good thermal and mechanical
properties are highly appreciated in the thermal management of modern electronic devices …

Can Adhesion Energy Optimize Interface Thermal Resistance at a Soft/Hard Material Interface?

X Cheng, D He, M Zhou, P Zhang, S Wang, L Ren… - Nano Letters, 2023 - ACS Publications
Thermal resistance at a soft/hard material interface plays an undisputed role in the
development of electronic packaging, sensors, and medicine. Adhesion energy and phonon …

[PDF][PDF] Rapid eradication of antibiotic-resistant bacteria and biofilms by MXene and near-infrared light through photothermal ablation

F Wu, H Zheng, W Wang, Q Wu, Q Zhang, J Guo… - Sci. China …, 2021 - researchgate.net
With the development and rising of antimicrobial resistance, rapid and effective killings of
bacteria are urgently needed, especially for antibiotic-resistant bacteria and bacterial …

Transport phenomena in nano/molecular confinements

M Nazari, A Davoodabadi, D Huang, T Luo… - ACS …, 2020 - ACS Publications
The transport of fluid and ions in nano/molecular confinements is the governing physics of a
myriad of embodiments in nature and technology including human physiology, plants …

Weaker bonding can give larger thermal conductance at highly mismatched interfaces

B Xu, S Hu, SW Hung, C Shao, H Chandra… - Science …, 2021 - science.org
Thermal boundary conductance is typically positively correlated with interfacial adhesion at
the interface. Here, we demonstrate a counterintuitive experimental result in which a weak …