Classifications and applications of inkjet printing technology: A review
Inkjet printing technology uses the low-cost direct deposition manufacturing technique for
printing and is applicable in various fields including optics, ceramics, three-dimensional …
printing and is applicable in various fields including optics, ceramics, three-dimensional …
A perspective of recent advances in PECVD-grown graphene thin films for scientific research and technological applications
The purpose of this review is to provide a perspective on some of the recent advances in
applying graphene thin films, including monolayer and multilayer graphene sheets …
applying graphene thin films, including monolayer and multilayer graphene sheets …
Single-step direct growth of graphene on Cu ink toward flexible hybrid electronic applications by plasma-enhanced chemical vapor deposition
Highly customized and free-formed products in flexible hybrid electronics (FHE) require
direct pattern creation such as inkjet printing (IJP) to accelerate product development. In this …
direct pattern creation such as inkjet printing (IJP) to accelerate product development. In this …
On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
A Roshanghias, M Dreissigacker, C Scherf… - Micromachines, 2020 - mdpi.com
Fan-out wafer-level packaging (FOWLP) is an interesting platform for
Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS …
Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS …
Additive-manufactured organic interposers
A Roshanghias, M Krivec… - Journal of …, 2020 - asmedigitalcollection.asme.org
The trend toward heterogeneous integration of optoelectronic, electronic, and
micromechanical components favors three-dimensional (3D) integration in which the …
micromechanical components favors three-dimensional (3D) integration in which the …
Flexible, Fan-Out, Wafer-Level Packaging Using Polydimethylsiloxane and Printed Redistribution Layers
The hybrid integration of electronics in flexible substrates using fanned-out, wafer-level
packaging (FOWLP) has recently gained significant attention, with numerous applications in …
packaging (FOWLP) has recently gained significant attention, with numerous applications in …
P‐60: Single‐Step Plasma‐Enhanced Chemical Vapor Deposition of Graphene on Cu Ink and Sputtered Cu Thin Films
Ink materials for Inkjet Printing generally suffer from low conductivity, whereas the thickness
of Cu interconnects requires further reduction for better flexibility. Here we demonstrate …
of Cu interconnects requires further reduction for better flexibility. Here we demonstrate …
Strategic Advances in 2D Materials: Low-Temperature Plasma-Enhanced Chemical Vapor Deposition Growth of Graphene and Complementary Insights into MoS₂
CH Lu - 2024 - thesis.library.caltech.edu
This thesis explores the intricate details of the plasma-enhanced chemical vapor deposition
(PECVD) technique for growing graphene on various substrates at low temperatures. The …
(PECVD) technique for growing graphene on various substrates at low temperatures. The …
High-Resolution Printing of Redistribution Layers for Fan-Out Wafer-Level Packaging by using Ultra-Precise Micro-deposition Technology
A Roshanghias, M Dreissigacker… - 2022 IEEE 9th …, 2022 - ieeexplore.ieee.org
Implementing Additively Manufactured Redistribution Layers (AM-RDL) for Fan-Out Wafer-
Level Packaging (FOWLP) has spurred interest recently. Especially for MEMS FOWLP …
Level Packaging (FOWLP) has spurred interest recently. Especially for MEMS FOWLP …
Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pads Printed by Aerosol Jet
Additive manufacturing has been extensively studied as a promising candidate for complete
or partial replacement of traditional photolithography methods. The focus of this paper is on …
or partial replacement of traditional photolithography methods. The focus of this paper is on …