Microprocessor design has recently encountered many constraints such as power, energy,
reliability, and temperature. Among these challenging issues, temperature-related issues …

Data centers can go green by saving electricity in two major areas: computing and cooling.
Servers in data centers require a constant supply of cold air from on-site cooling …

A series of novel polymer composites consisting of graphene foam (GF), carbon black (CB)
and polydimethylsiloxane (PDMS) were designed and fabricated. Their microstructures and …

For around three decades software engineering gurus have" sold" us the ideal of minimal
coupling and maximal cohesion at all levels of abstraction as a way to reduce the effort to …

Owing to overheating of electronic components during work, more and more attention has
been paid to the research of high thermal conductivity polymer composites in recent years …

Thermal management has become a serious problem with development of miniaturized,
high integration and high performance electronics devices, where the improvement of …

Electromigration (EM) is re-emerging as a significant problem in modern integrated circuits
(IC). Especially in power grids, due to shrinking wire widths and increasing current densities …

In nano-scale regime, there are various sources of uncertainty and unpredictability of VLSI
designs such as transistor aging mainly due to Bias Temperature Instability (BTI) as well as …

In the nanometer era, runtime variations due to workload dependent voltage and
temperature variations as well as transistor aging introduce remarkable uncertainty and …

Artificial neural networks (ANNs) have shown great promise in modeling circuit parameters
for computer aided design applications. Leakage currents, which depend on process …