Apparatus and methods are described that include ultrasound imaging devices, which may
operate in a transmissive ultrasound imaging modality, and which may be used to detect …

(57) ABSTRACT Related US Application Data (60) Provisional application No. 60/999,641,
filed on Oct. 18, 2007. A capacitive micromachined ultrasonic transducer (CMUT) array …

A one or two-dimensional capacitive micro-machined ultrasonic transducer (CMUT) array
with supporting frame is provided. The CMUT array has at least three array elements …

A wafer-level, batch processed, die-sized integrated circuit (IC) package with both top and
bottom side electrical connections is disclosed. In one aspect, a number of bonding wires …

Low temperature wafer bonding (temperature of 450 C. or less) is employed to fabricate
CMUTs on a wafer that already includes active electrical devices. The resulting structures …

The present invention relates to a method for making an integrated sensor comprising
providing a sensor array fabricated on a top surface of a bulk silicon wafer having a top …

This disclosure provides systems, methods and apparatus for microspeaker devices. In one
aspect, a microspeaker element may include a deformable dielectric membrane that spans a …

A through silicon via structure and a method of fabricating the through silicon via. The
method includes:(a) forming a trench in a silicon substrate, the trench open to a top surface …

(54) METHODS OF MAKING AND USING 6,589, 180 B2 7/2003 Erikson et al. INTEGRATED
AND TESTABLE SENSOR 6,713,828 B1* 3/2004 Chavan et al............... 257/415 ARRAY …

An electromechanical transducer includes multiple elements each including at least one
cellular structure, the cellular structure including: a semiconductor Substrate, a semicon …