Electrochemical migration (ECM) is one of the serious failure modes encountered in
electronic devices due to the electrochemical reactions triggered by the presence of …

Electrochemical migration failure is the main reliability problem that silver conductive
adhesives face in the field of power electronics. However, there is no prior existing study that …

Voids in solder joints induced by electromigration significantly affect the mechanical and
electrical properties of materials, causing performance degradation and reduction in …

Reactive transport processes in natural environments often involve many ionic species. The
diffusivities of ionic species vary. Since assigning different diffusivities in the advection …

Electrochemical migration (ECM) is a common cause of failure in printed circuit boards
(PCB) due to dendrite growth between exposed metallic conductors under moisture …

Electrochemical migration in electronic devices plays a significant role in lifetime and
reliability. In this work, dynamic characteristics of ions migration and evolution of dendrites …

Electrochemical migration (ECM) is receiving increased attention and requires further
investigations due to the continuous miniaturization in microelectronics. A numerical ECM …

In this study, the effects of nonstandard near-eutectic SnAg surfaces on the wettability,
intermetallic compound growth and mechanical properties of solder joints were investigated …

Electrochemical migration (ECM) on the surface of printed circuit boards (PCBs) continues to
pose a significant reliability risk in electronics. Nevertheless, the existing literature lacks …

This article presents a high-frequency characterization from 1 up to 10 GHz of electroplated
conductive filaments in 3D printed microwave topologies. This study implements different …