The corrosion behavior of Fe and Bi added Sn-0.7 Cu solder was investigated in 3.5 wt%
NaCl solution. Addition of Fe and Bi results in higher corrosion current density, reduction in …

Abstract Sn–Ag–Cu lead-free solders, containing alloy elements and nanoparticles, have
been extensively investigated. With the extensive prevalence of 3D IC package, a major …

Abstract A lead-free Sn-2.5 Ag-0.7 Cu base solder with different weight percentages of
bismuth (0, 1, 2.5, 5) was used. Thermal properties, microstructure, wettability and …

For development of lead-free solder for advance electrical components, the correlation of
microstructure with thermal and creep properties of novel Ni-doped Sn–0.5 Ag–0.7 Cu (SAC …

Abstract Nano-sized, non-reacting, non-coarsening SiC particles were successfully
fabricated by high energy ball milling. Mechanically mixing was adopted to prepare SiC …

In this study, the SiC nanoparticles were successfully fabricated by high energy ball milling.
Mechanical mixing technique has been used to disperse nanometric SiC in Sn–1.0 Ag–0.5 …

To optimize the mechanical properties of low-Ag lead-free solder, different amount of Bi
element was added into the Sn–1.0 Ag–0.5 Cu (SAC105) to form SAC105-x Bi (0≤ x≤ 4) …

In this study, the Sn1. 0Ag0. 5Cu–0.5 Fe 2 O 3 (SAC105–0.5 Fe 2 O 3) composite solders
reinforced by γ-Fe 2 O 3 nanoparticles with size of 20 nm, 50 nm and 200 nm, respectively …

In this paper, Al nanoparticles were manually mixed into the Sn–1Ag–0.5 Cu solder paste to
prepare composite solder. The content of Al nanoparticles ranged from 0 to 0.4 wt% in the …

In this work, the microstructure, electrochemical and mechanical properties of Sn-3.0 Ag-0.5
Cu solder alloy with Fe and Ho additions were studied. The results demonstrated that …