[图书][B] VLSI test principles and architectures: design for testability

LT Wang, CW Wu, X Wen - 2006 - books.google.com
This book is a comprehensive guide to new DFT methods that will show the readers how to
design a testable and quality product, drive down test cost, improve product quality and …

Survey of test vector compression techniques

NA Touba - IEEE Design & test of computers, 2006 - ieeexplore.ieee.org
Test data compression consists of test vector compression on the input side and response,
compaction on the output side. This vector compression has been an active area of …

[图书][B] Electronic design automation: synthesis, verification, and test

LT Wang, YW Chang, KTT Cheng - 2009 - books.google.com
This book provides broad and comprehensive coverage of the entire EDA flow. EDA/VLSI
practitioners and researchers in need of fluency in an" adjacent" field will find this an …

[图书][B] System-on-chip test architectures: nanometer design for testability

LT Wang, CE Stroud, NA Touba - 2010 - books.google.com
Modern electronics testing has a legacy of more than 40 years. The introduction of new
technologies, especially nanometer technologies with 90nm or smaller geometry, has …

XPAND: An efficient test stimulus compression technique

S Mitra, KS Kim - IEEE Transactions on Computers, 2006 - ieeexplore.ieee.org
Combinational circuits implemented with exclusive-or gates are used for on-chip generation
of deterministic test patterns from compressed seeds. Unlike major test compression …

Test data compression for system-on-a-chip using extended frequency-directed run-length code

AH El-Maleh - IET Computers & Digital Techniques, 2008 - IET
One of the major challenges in testing a system-on-a-chip is dealing with the large volume of
test data. To reduce the volume of test data, several test data compression techniques have …

Historical perspective on scan compression

R Kapur, S Mitra, TW Williams - IEEE Design & Test of …, 2008 - ieeexplore.ieee.org
Since gaining popularity in the late 1990s, the term" scan compression" has maintained a
solid hold within the IC test lexicon. In recent years, however, this technology has taken the …

Trimodal scan-based test paradigm

G Mrugalski, J Rajski, J Solecki… - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
This paper presents a novel scan-based design for test (DFT) paradigm. Compared with
conventional scan, the presented approach either significantly reduces test application time …

Method and apparatus for testing 3D integrated circuits

LT Wang, NA Touba, MS Hsiao, Z Jiang… - US Patent 8,522,096, 2013 - Google Patents
BACKGROUND Three-dimensional (3D) packaging is short for 3D die stacking using
through-silicon Vias (TSVs), conceptually similar to nails, as opposed to wire-bonds for …

Using limited dependence sequential expansion for decompressing test vectors

A Dutta, NA Touba - 2006 IEEE International Test Conference, 2006 - ieeexplore.ieee.org
Existing techniques that incorporate decompressor constraints in the ATPG
search/backtrace (eg, Illinois scan) are based on combinational expansion in which each …