Thermosonic ball bonding is a metallurgical process that until recently was rarely the subject
of metallurgical analysis. However, in recent years greater focus has been given to the …

Power Electronic Packaging presents an in-depth overview of power electronic packaging
design, assembly, reliability and modeling. Since there is a drastic difference between IC …

In this paper, a transient non-linear dynamic finite element framework is developed, which
integrates the wire bonding process and the silicon devices under the bond pad. Two major …

CMOS-based microsensors benefit from well-established fabrication technologies and the
possibility of on-chip circuitry. In these devices, added on-chip functionality can be …

Fracture characteristics at the interface of ultrasonic bonds between Au and Al were
characterized by SEM following pull-testing to effect separation of the bonded joints. Vertical …

This paper reports the design, fabrication, and characterization of a two-dimensional stress-
sensor array based on a stress-sensor element exploiting the transverse pseudo-Hall effect …

The effect of bonding duration and substrate temperature on the nano-scale interfacial
structure for bonding strength were investigated using high resolution transmission electron …

The thermo-structural analysis of ultrasonic wire bonding is performed by means of 3D finite
element method. A special focus has been placed on monitoring the temperature rise during …

A model of friction during thermosonic ball bonding is reported. The model is based on
recent ultrasonic stress measurements during ball bonding using piezoresistive …

This work presents an approach to separate the thermal response due to ultrasonic
excitation and ball deformation through novel application of aluminum-polysilicon …