Ultrafast and nanoscale energy transduction mechanisms and coupled thermal transport across interfaces

A Giri, SG Walton, J Tomko, N Bhatt, MJ Johnson… - ACS …, 2023 - ACS Publications
The coupled interactions among the fundamental carriers of charge, heat, and
electromagnetic fields at interfaces and boundaries give rise to energetic processes that …

A critical review of thermal boundary conductance across wide and ultrawide bandgap semiconductor interfaces

T Feng, H Zhou, Z Cheng, LS Larkin… - ACS applied materials …, 2023 - ACS Publications
The emergence of wide and ultrawide bandgap semiconductors has revolutionized the
advancement of next-generation power, radio frequency, and opto-electronics, paving the …

Thermal transport in defective and disordered materials

R Hanus, R Gurunathan, L Lindsay, MT Agne… - Applied Physics …, 2021 - pubs.aip.org
With significant recent advancements in thermal sciences—such as the development of new
theoretical and experimental techniques, and the discovery of new transport mechanisms—it …

Optical super-resolution nanothermometry via stimulated emission depletion imaging of upconverting nanoparticles

Z Ye, B Harrington, AD Pickel - Science Advances, 2024 - science.org
From engineering improved device performance to unraveling the breakdown of classical
heat transfer laws, far-field optical temperature mapping with nanoscale spatial resolution …

Defect scattering can lead to enhanced phonon transport at nanoscale

Y Hu, J Xu, X Ruan, H Bao - Nature Communications, 2024 - nature.com
Defect scattering is well known to suppress thermal transport. In this study, however, we
perform both molecular dynamics and Boltzmann transport equation calculations, to …

Near-junction phonon thermal spreading in GaN HEMTs: A comparative study of simulation techniques by full-band phonon Monte Carlo method

Y Shen, HA Yang, BY Cao - International Journal of Heat and Mass …, 2023 - Elsevier
Accurate thermal simulation is essential for the near-junction thermal management and
electro-thermal co-design of GaN HEMTs. While various methods have been employed to …

Heat transport at silicon grain boundaries

E Isotta, S Jiang, R Bueno‐Villoro… - Advanced Functional …, 2024 - Wiley Online Library
Engineering microstructural defects, like grain boundaries, offers superior control over
transport properties in energy materials. However, technological advancement requires …

Impact of electron-phonon interaction on thermal transport: A review

Y Quan, S Yue, B Liao - Nanoscale and Microscale Thermophysical …, 2021 - Taylor & Francis
ABSTRACT A thorough understanding of the microscopic picture of heat conduction in
solids is critical to a broad range of applications, from thermal management of …

Gecko-inspired adhesive structures enable efficiently thermal conductance and vibration dissipation in a highly mismatched system

J Fan, S Ding, X Zeng, S Gao, Z Wen, X Zeng… - Chemical Engineering …, 2022 - Elsevier
There is often a trade-off between thermal conductance and vibration dissipation of polymer-
based thermal interface materials (TIMs). Achieving efficient thermal management requires a …

Interface formation evolution of the hot-forged copper-(Cr) diamond composite and its thermal conductivity

SQ Jia, L Bolzoni, T Li, F Yang - Journal of Alloys and Compounds, 2023 - Elsevier
Due to the distinction of (111) and (100) faces on the diamond particle, the preferential
formation of interface layers on the diamond particle is discovered when adding metal …