As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …

Microalloying, in which the solidification structure is preferably and significantly modified by
trace elements, is a key method for improving Pb-free interconnections in electronic devices …

Recently, research into the factors that influence the formation and growth of intermetallic
compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important …

Abstract In powderswith different contents (0.5− 10 wt.%) were melted into the Sn− 3.0 Ag−
0.5 Cu (SAC305) solder to change the microstructure and thus improve the properties of the …

Abstract Sn-0.7 Cu–In ternary alloy solders have received much attention because of their
excellent weld stability and wettability. However, how to inhibit or slow down the formation of …

The void defect in intermetallic compounds (IMCs) layer at the joints caused by
inhomogeneous atomic diffusion is one of the most important factors limiting the further …

The microstructure and mechanical properties of Sn-0.7 Cu solder alloy and Sn-0.7 Cu with
1.0–5.0 wt% indium addition were investigated in this study. With indium added into Sn-0.7 …

Formation/growth behaviour, phase stability, and mechanical properties of interfacial Cu 6
Sn 5 intermetallics influenced by micro-alloying in Pb-free solder joints, are of ongoing …

Cu6Sn5 is an important intermetallic compound (IMC) commonly formed during lead-free
soldering. It is known that Cu6Sn5 exhibits significantly different thermo-mechanical …

A systematic study of the solidification mechanisms of binary Sn-Cu and ternary Sn-Cu-Ni
alloys has been carried out. It is found that Sn-Cu is a weakly-irregular eutectic system with …