Overview of wire bonding using copper wire or insulated wire
ZW Zhong - Microelectronics Reliability, 2011 - Elsevier
Wire bonding using copper or insulated wire leads to many advantages and new
challenges. Research is intensively performed worldwide, leading to many new findings and …
challenges. Research is intensively performed worldwide, leading to many new findings and …
[图书][B] Copper wire bonding
Chapter 1 gives an introduction to Cu wire bonding technology. The advantages of Cu over
Au, such as lower cost, higher mechanical strength, and higher electrical and thermal …
Au, such as lower cost, higher mechanical strength, and higher electrical and thermal …
Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding
In this work, we investigate the intermetallic compound formation in Cu wire bonded device.
Voids near the Cu side at the bond interface are clearly seen. Nevertheless, these voids do …
Voids near the Cu side at the bond interface are clearly seen. Nevertheless, these voids do …
Growth of CuAl intermetallic compounds in Cu and Cu (Pd) wire bonding
In this study, Cu wire bonds are aged at 150, 175, 250, and 350° C for time ranging from 5
min to 2000 h. The top temperature of 350° C is chosen to have the fastest kinetics, while …
min to 2000 h. The top temperature of 350° C is chosen to have the fastest kinetics, while …
Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA
S Jasmee, J Palagud Jr, W SW, KI Hoo… - Journal of Materials …, 2024 - Springer
Abstract Au-coated Ag Alloys (ACA) have emerged as a new bonding wire in semiconductor
industries with lower costs for CMOS iBGA applications. However, a wide gap of study …
industries with lower costs for CMOS iBGA applications. However, a wide gap of study …
Effects of bonding parameters on free air ball properties and bonded strength of Ag-10Au-3.6 Pd alloy bonding wire
J Cao, J Zhang, J Persic, K Song - Micromachines, 2020 - mdpi.com
Free air ball (FAB) and bonded strength were performed on an Ag-10Au-3.6 Pd alloy
bonding wire (diameter of 0.025 mm) for different electronic flame-off (EFO) currents, times …
bonding wire (diameter of 0.025 mm) for different electronic flame-off (EFO) currents, times …
Au wire ball welding and its reliability test for high-temperature environment
C Wu, J Wang, X Liu, M Li, Z Zhu, Y Qi - Micromachines, 2022 - mdpi.com
The long-term application of sensors in a high-temperature environment needs to address
several challenges, such as stability at high temperatures for a long time, better wiring …
several challenges, such as stability at high temperatures for a long time, better wiring …
Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires
HW Hsueh, FY Hung, TS Lui, LH Chen - Microelectronics reliability, 2013 - Elsevier
In the microelectronics assembly and packaging industry, the wire bonding has become an
important process to connect lead frames and pads. In the past, gold and copper were the …
important process to connect lead frames and pads. In the past, gold and copper were the …
Dynamics of free air ball formation in thermosonic wire bonding
F Wang, K Xiang, L Han - IEEE Transactions on Components …, 2012 - ieeexplore.ieee.org
In thermosonic wire bonding, a free air ball (FAB) created by electronic flame-off (EFO) is
crucial to a reliable first bond. To reveal the mechanisms of FAB and ripple formation, the …
crucial to a reliable first bond. To reveal the mechanisms of FAB and ripple formation, the …
Low cost Pd coated Ag bonding wire for high quality FAB in air
S Tanna, JL Pisigan, WH Song, C Halmo… - 2012 IEEE 62nd …, 2012 - ieeexplore.ieee.org
A 25 μm diameter Ag wire is coated with a nano-layer of Pd to form a Palladium coated
Silver bonding wire (PCS). A new method is used in which the coating is directly attached to …
Silver bonding wire (PCS). A new method is used in which the coating is directly attached to …