Improved PGC demodulation algorithm to eliminate modulation depth and intensity disturbance
Y Li, H Gao, L Zhao, Z Fu, J Zhang, Z Li, X Qiao - Applied Optics, 2022 - opg.optica.org
In this paper, an improved phase generated carrier (PGC) demodulation algorithm based on
frequency mixing and division difference is proposed. The effects of phase modulation depth …
frequency mixing and division difference is proposed. The effects of phase modulation depth …
Precision vibration measurement using differential phase-modulated homodyne interferometry
A novel precision vibration measurement using differential phase-modulated homodyne
interferometry is presented. The orthogonal linearly polarized phase-modulated single …
interferometry is presented. The orthogonal linearly polarized phase-modulated single …
Adaptive phase noise cancellation technique for fiber-optic interferometric sensors
MY Plotnikov, AV Volkov - Journal of Lightwave Technology, 2021 - opg.optica.org
The optical source phase noise is one of the main factors influencing the noise performance
of fiber-optic interferometric measurement systems. The phase noise is directly proportional …
of fiber-optic interferometric measurement systems. The phase noise is directly proportional …
Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding
AA Vlasov, T Uusitalo, H Virtanen… - IEEE Photonics …, 2023 - ieeexplore.ieee.org
Current development trends concerning miniaturizing of electronics and photonics systems
are aiming at assembly and 3D co-integration of a broad range of technologies including …
are aiming at assembly and 3D co-integration of a broad range of technologies including …
Machine vision system utilizing black silicon cmos camera for through-silicon alignment
AA Vlasov, AE Aydin, T Uusitalo… - IEEE Transactions …, 2022 - ieeexplore.ieee.org
Current development trends concerning miniaturizing of electronics and photonics systems
are aiming at assembly and 3-D co-integration of a broad range of technologies including …
are aiming at assembly and 3-D co-integration of a broad range of technologies including …
Compensating the influence of background noise on the operation of a fiber-optic interferometer
AA Vlasov, MY Plotnikov, AV Volkov… - Journal of Optical …, 2020 - opg.optica.org
The results of an experimental test of the effectiveness of a method for compensating the
influence of background noise on the operation of a fiber-optic compensative interferometer …
influence of background noise on the operation of a fiber-optic compensative interferometer …
Laser-assisted bonding approach for photonic integration processes
AA Vlasov, T Uusitalo, E Lepukhov… - 2023 24th European …, 2023 - ieeexplore.ieee.org
Current development trends concerning miniaturizing of electronics and photonics systems
are aiming at assembly and 3D co-integration of a broad range of technologies including …
are aiming at assembly and 3D co-integration of a broad range of technologies including …
Environmental noise cancellation technique for the compensation interferometer in fiber-optic PMDI-based sensor arrays
AA Vlasov, MY Plotnikov, AS Aleinik… - IEEE Sensors …, 2020 - ieeexplore.ieee.org
A path matched differential interferometry (PMDI) is one of the most common architectures
for fiber-optic sensor arrays. It allows to interrogate many fiber-optic sensors time …
for fiber-optic sensor arrays. It allows to interrogate many fiber-optic sensors time …
Laser-Assisted Bonding of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit with Through-Silicon Alignment
AA Vlasov, S Lehtinen, E Lepukhov… - 2024 IEEE 10th …, 2024 - ieeexplore.ieee.org
The progression of hybrid integration technology for compact electronics and photonics
systems is placing increasing demands on the development of novel automated procedures …
systems is placing increasing demands on the development of novel automated procedures …
Integration of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit Using Laser-Assisted Bonding
A Vlasov, S Lehtinen, E Lepukhov… - 2024 IMAPS Nordic …, 2024 - ieeexplore.ieee.org
The advancement of hybrid integration technology for smaller electronics and photonics
systems is exerting increased pressure on the development of new automated processes …
systems is exerting increased pressure on the development of new automated processes …