Scalable 3D silicon photonic electronic integrated circuits and their applications
This paper investigates the opportunity and challenges of 3D silicon photonic electronic
integrated circuits (3D EPICs) scaling to wafer-scale and beyond. The continuing demand …
integrated circuits (3D EPICs) scaling to wafer-scale and beyond. The continuing demand …
Through-silicon via-based capacitor and its application in LDO regulator design
L Qian, K Qian, X He, Z Chu, Y Ye… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
Using coaxial through-silicon technologies, a new 3-D capacitor integrated on a silicon
interposer is proposed. The capacitance of coaxial through silicon via (CTSV) capacitors is …
interposer is proposed. The capacitance of coaxial through silicon via (CTSV) capacitors is …
Investigating on through glass via based RF passives for 3-D integration
L Qian, J Sang, Y Xia, J Wang… - IEEE Journal of the …, 2018 - ieeexplore.ieee.org
Due to low dielectric loss and low cost, glass is developed as a promising material for
advanced interposers in 2.5-D and 3-D integration. In this paper, through glass vias (TGVs) …
advanced interposers in 2.5-D and 3-D integration. In this paper, through glass vias (TGVs) …
Area-efficient extended 3-D inductor based on TSV technology for RF applications
C Qu, Z Zhu, Y En, L Wang, X Liu - IEEE Transactions on Very …, 2020 - ieeexplore.ieee.org
An extended model of through-silicon via (TSV)-based solenoid inductor is proposed to save
on-chip areas for 3-D radio frequency (RF) ICs and package integration. To achieve a high …
on-chip areas for 3-D radio frequency (RF) ICs and package integration. To achieve a high …
Cu/Co multilayer-based high signal integrity and low RF loss conductors for 5G/millimeter wave applications
This paper presents copper/cobalt (Cu/Co) multilayer-based low RF loss conductors and
their usage in high signal integrity coplanar waveguide (CPW) transmission lines (TLs) and …
their usage in high signal integrity coplanar waveguide (CPW) transmission lines (TLs) and …
Modeling and Measurement of 3D Solenoid Inductor Based on Through-Silicon Vias
Through-silicon via (TSV) provides vertical interconnectivity among the stacked dies in three-
dimensional integrated circuits (3D ICs) and is a promising option to minimize 3D solenoid …
dimensional integrated circuits (3D ICs) and is a promising option to minimize 3D solenoid …
3D TSV based high frequency components for RF IC and RF MEMS applications
M Fernández-Bolaños, WA Vitale… - 2016 IEEE …, 2016 - ieeexplore.ieee.org
We demonstrate and review the unique fine-pitch high-aspect ratio tungsten-filled through-
silicon vias (W-TSVs) technology developed by Fraunhofer EMFT in high-resitivity silicon …
silicon vias (W-TSVs) technology developed by Fraunhofer EMFT in high-resitivity silicon …
3D photonics as enabling technology for deep 3D DRAM stacking
3D stacking improves bandwidth, energy, and latency of DRAMs by exploiting shorter and
more abundant wiring in three dimensions. While future stacks are predicted to provide tens …
more abundant wiring in three dimensions. While future stacks are predicted to provide tens …
Ultra-compact, high-performance, 3D-IPD integrated using conformal 3D interconnects
A Ghannam, A Magnani, D Bourrier… - 2018 IEEE 68th …, 2018 - ieeexplore.ieee.org
A 3D technology for fabrication of ultra-compact, high-performance 3D integrated passive
devices (3D-IPD) is presented here. The technology comprises high-Q thin film MIM …
devices (3D-IPD) is presented here. The technology comprises high-Q thin film MIM …
First order Electro-thermal compact models and noise considerations for three-dimensional integration circuits
Y Ma - 2018 - hal.science
Three Dimensional (3D) Integration and Packaging has been successful in mainstream
devices to increase logic density and to reduce data movement distances. It solves the …
devices to increase logic density and to reduce data movement distances. It solves the …