Review of silicon carbide power devices and their applications

X She, AQ Huang, O Lucia… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Silicon carbide (SiC) power devices have been investigated extensively in the past two
decades, and there are many devices commercially available now. Owing to the intrinsic …

Review of silicon carbide processing for power MOSFET

C Langpoklakpam, AC Liu, KH Chu, LH Hsu, WC Lee… - Crystals, 2022 - mdpi.com
Owing to the superior properties of silicon carbide (SiC), such as higher breakdown voltage,
higher thermal conductivity, higher operating frequency, higher operating temperature, and …

[图书][B] Gallium nitride and silicon carbide power devices

BJ Baliga - 2016 - books.google.com
During the last 30 years, significant progress has been made to improve our understanding
of gallium nitride and silicon carbide device structures, resulting in experimental …

Current status and perspectives of ultrahigh-voltage SiC power devices

T Kimoto, Y Yonezawa - Materials Science in Semiconductor Processing, 2018 - Elsevier
Recent progress in the SiC material and ultrahigh-voltage devices is reviewed. Regarding
the material issues, fast epitaxial growth of high-purity epitaxial layers and reduction of basal …

Ultrahigh-voltage SiC pin diodes with improved forward characteristics

N Kaji, H Niwa, J Suda, T Kimoto - IEEE Transactions on …, 2014 - ieeexplore.ieee.org
Silicon carbide (SiC) pin diodes having five different n--layer (i-layer) thicknesses from 48 to
268 μm are fabricated. The forward characteristics of SiC pin diodes are significantly …

A new edge termination technique for high-voltage devices in 4H-SiC–multiple-floating-zone junction termination extension

W Sung, E Van Brunt, BJ Baliga… - IEEE Electron Device …, 2011 - ieeexplore.ieee.org
A new edge termination method, referred to as multiple-floating-zone junction termination
extension (MFZ-JTE), is presented for high-voltage devices in 4H-SiC. 4H-SiC PiN rectifiers …

A near ideal edge termination technique for 4500V 4H-SiC devices: The hybrid junction termination extension

W Sung, BJ Baliga - IEEE Electron Device Letters, 2016 - ieeexplore.ieee.org
This letter presents a new edge termination technique named a hybrid junction termination
extension (Hybrid-JTE), which combines ring-assisted JTE and multiple floating zone JTE …

21-kV SiC BJTs with space-modulated junction termination extension

H Miyake, T Okuda, H Niwa, T Kimoto… - IEEE Electron Device …, 2012 - ieeexplore.ieee.org
We report here 20-kV-class small-area (0.035 mm 2) 4H-SiC bipolar junction transistors. We
implemented edge termination techniques featuring two-zone junction termination extension …

Space-modulated junction termination extension for ultrahigh-voltage pin diodes in 4H-SiC

G Feng, J Suda, T Kimoto - IEEE transactions on electron …, 2011 - ieeexplore.ieee.org
An edge termination method, referred to as space-modulated junction termination extension
(SMJTE) combined with a mesa structure, is presented for ultrahigh-voltage pin diodes in 4H …

Deeply and vertically etched butte structure of vertical GaN p–n diode with avalanche capability

H Fukushima, S Usami, M Ogura, Y Ando… - Japanese Journal of …, 2019 - iopscience.iop.org
A vertical p–n diode with a simple edge termination structure on a GaN free-standing
substrate is demonstrated. The edge of this device is terminated simply by etching a drift …