This paper gives a review of different applications in the numerical modelling of reflow
soldering technology from recent years. The focus was on detailing the different process …

The escalating demand for high-performance computing is driving the expansion of high-
end packages, leading to increased power requirements. Efficient heat dissipation is crucial …

Multilayer ceramic capacitors (MLCCs) are critical components when thermal processes
such as reflow desoldering are used during rework of electronic assemblies. The capacitor's …

The nozzle-matrix gas flow velocity has a great influence on the accuracy of the temperature
field of a printed circuit board assembly (PCBA) during the hot air convection reflow …

Reflow soldering is a technique that temporarily applies solder paste to contact pads of
numerous surface mount components Reflow profiling is an optimization process to …

This thesis focuses on optimizing the reflow soldering process to enhance PCB component
adhesion, employing ANSYS simulation software for a comprehensive analysis. Reflow …