Quantifying spectral thermal transport properties in framework of molecular dynamics simulations: a comprehensive review

YX Xu, HZ Fan, YG Zhou - Rare Metals, 2023 - Springer
Over the past few decades, significant progress has been made in micro-and nanoscale
heat transfer. Numerous computational methods have been developed to quantitatively …

Heat transfer enhancement− A brief review of literature in 2020 and prospects

Z Guo, L Cheng, H Cao, H Zhang… - Heat transfer …, 2021 - dl.begellhouse.com
This review provides a brief literature survey on enhanced heat transfer research published
in the English language journals in 2020. A topic search containing either" heat transfer" or" …

Enhanced heat transport capability across boron nitride/copper interface through inelastic phonon scattering

J Wang, Z Wang, K Yang, N Chen, J Ni… - Advanced Functional …, 2022 - Wiley Online Library
Interfacial thermal resistance plays a critical role in heat dissipation, when the mean free
paths of heat energy carriers approach or exceed the characteristic lengths of devices. Deep …

[HTML][HTML] Enhancing interfacial thermal transport efficiently in diamond/graphene heterostructure by involving vacancy defects

Y Liu, L Qiu, Z Wang, H Li, Y Feng - Composites Part A: Applied Science …, 2024 - Elsevier
The enhancement of interfacial thermal conductance is critical to the efficient heat
dissipation in micro-and nano-devices. The introduction of defects is a special method to …

Thermal Transport of AlN/Graphene/3C-SiC Typical Heterostructures with Different Crystallinities of Graphene

B Yang, C Peng, M Song, Y Tang, Y Wu… - … Applied Materials & …, 2022 - ACS Publications
It is proven that introduction of graphene into typical heterostructures can effectively reduce
the high interfacial thermal resistance in semiconductor chips. The crystallinity of graphene …

[HTML][HTML] Diffusion behavior determined by the new n-body potential in highly immiscible W/Cu system through molecular dynamics simulations

K Wang, X Chen, S Huang, X Chen, Z Wang… - Journal of Materials …, 2023 - Elsevier
The excellent properties exhibited by W/Cu composites have stimulated the interest of many
researchers. Molecular dynamics (MD) plays an important role in regulating the alloy ratio …

Insights into Thermal Conductivity at the MOF-Polymer Interface

P Vo, M Haranczyk - ACS Applied Materials & Interfaces, 2024 - ACS Publications
Understanding the thermal conductivity in metal–organic framework (MOF)-polymer
composites is crucial for optimizing their performance in applications involving heat transfer …

Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface

K Wu, L Zhang, F Li, L Sang, M Liao, K Tang, J Ye… - Carbon, 2024 - Elsevier
Effective heat dissipation of semiconductor devices is crucial for their extended lifespan and
operational stability, and the interface of semiconductors provides an effective window for …

Impacts of various interfacial nanostructures on spectral phonon thermal boundary conductance

R Xie, J Tiwari, T Feng - Journal of Applied Physics, 2022 - pubs.aip.org
Nanoengineering of interfaces has become an effective way to tune the thermal boundary
conductance (TBC) of heterostructures. However, the same nanostructure design can have …

Thermal transport mechanism of AlN/SiG/3C–SiC typical heterostructures

B Yang, J Wang, Z Yang, Z Xin, N Zhang, H Zheng… - Materials Today …, 2023 - Elsevier
Understanding the heat transfer mechanism of typical structures in high-power chips is
essential for chip design with better engineered heat transfer performance. Here, the …