the present invention generally relates to semiconductor devices. More particularly, the
present invention relates to the integration of micro-electromechanical systems (MEMS) or …

In this paper, high-frequency electrothermal characteristics of the power delivery network
(PDN) are investigated for through-silicon-via (TSV)-based 3-D ICs by utilizing a self …

(57) In the management of a processor, logical operation activity is monitored for increases
from a low level to a high level during a sampling window across multiple cores sharing a …

In the management of a processor, logical operation activity is monitored for increases from
a low level to a high level during a sampling window across multiple cores sharing a …

Modern power electronic circuits typically require an on-board microcontroller to carry out
necessary sensor measurements and controlled semiconductor switching. Hence, in the …

Clock trees, which deliver the clock signal to every clock sink in the whole system, switch
actively at high frequency, which makes them one of the most dominant sources of noise …

the present invention generally relates to semiconductor devices. More particularly, the
present invention relates to the integration of micro-electromechanical systems (MEMS) or …

(57) ABSTRACT A design for an improved metal-on-metal capacitor design is described.
The design includes a Substantially diagonal feed line (411, 412,413) in each metal layer …

the present invention generally relates to semiconductor devices. More particularly, the
present invention relates to the integration of micro-electromechanical systems (MEMS) or …

US9929084B2 - Device with interconnection structure for forming a conduction path or a
conducting plane with high decoupling capacitance - Google Patents US9929084B2 - Device …