Integrated circuits (ICs) are challenged to deliver historically anticipated performance
improvements while increasing the cost and complexity of the technology with each …

Cutting fluids are the most effective method to lower the cutting temperature and decrease
the cutting tool wear. At the same time, the cutting fluids influence the corrosion resistance …

With the aggressive scaling of integrated circuits, ruthenium has been proposed as the next
generation barrier material to replace the conventional bilayer of tantalum and tantalum …

Electrochemical FABrication (EFAB) can fabricate complex metal microstructures.
Planarization is crucial in EFAB in terms of flatness and surface quality. Accordingly …

This work reports urea as a promising complexing agent in sodium carbonate-based
alumina slurry for chemical–mechanical planarization (CMP) of tantalum and copper. Ta and …

In the present work, tantalum (Ta) and copper (Cu) chemical mechanical polishing (CMP)
has been carried out using a polishing slurry containing 2 wt% alumina (abrasive), 1 wt …

Cerium oxide or ceria has garnered a wide range of applications due to its redox active
nature. This redox activity is due to oxygen vacancies on the surface of the ceria creating a …

The purpose of this study was a comprehensive examination of phenolic profile, vitamin C
content, antioxidant, anti-acethylcholinesterase, cytotoxic and antimicrobial activities of …