Flexible electronics such as mechanically compliant displays, sensors and solar cells, have
important applications in the fields of energy, national defence and biomedicine, etc. Various …

A 3D analytical approach is proposed to investigate the peeling mechanism of IC chip from
substrate, which is important for reliable electronic packaging. Chip-adhesive-substrate …

This paper proposes an efficient strategy to simultaneously insert multiple objects, which are
parallel connected by passive compliant mechanisms, in precision assembly. The …

Accurate peeling off and transferring of microchips play a critical role in LED die sorting
technology. Generally, sorting efficiency of more than 36 KUPH, and an alignment deviation …

The serious warpage issues of ultrathin chip-on-flex (UTCOF) assembly induced by
mismatched thermal stresses have greatly affected the mechanical stability and reliability of …

Over the past decade, technological developments have enabled the flip-chip packaging for
applications in computing, communications, and consumer electronics. With the developing …

Nondestructively and efficiently peeling thin chip from the adhesive tape is still one of the
crucial techniques in IC packaging technology. In order to improve the process efficiency, a …

Issues of chip/device transferring are becoming increasingly serious with the decreasing of
chip/device thickness and size. The application of ultra-thin (< 50 μm) silicon-based chips is …

This chapter focuses on the single-needle peeling-off process. The models subjected to a
transverse concentrated load resulting from the single ejector needle were established for …

This chapter mainly focuses on the modeling and optimization of the chip picking-up and
placing-on, including the processes of the chip picking-up through the vacuum adsorption …