Modeling of copper wire bonding process on high power LEDs
Z Chen, Y Liu, S Liu - Microelectronics Reliability, 2011 - Elsevier
In this paper, a couple thermal mechanical transient dynamic finite element framework of
copper wire bonding process on high power lighting emitting diodes (LEDs) is developed …
copper wire bonding process on high power lighting emitting diodes (LEDs) is developed …
Characterization and Modeling of Fine-Pitch Copper Ball Bonding on a Cu/Low-k Chip
Cu ball bonding faces more challenges than Au ball bonding, for example, excessive
deformation of the bond pad and damage of Cu/low-k structures, because of the much …
deformation of the bond pad and damage of Cu/low-k structures, because of the much …
Analytical and experimental characterization of bonding over active circuitry
Placing active circuitry directly underneath the bond pads is an effective way to reduce the
die size, and hence to achieve lower cost per chip. The main concern with such design is the …
die size, and hence to achieve lower cost per chip. The main concern with such design is the …
热超声键合第二焊点研究进展
徐庆升， 陈悦霖 - 电子与封装, 2021 - ep.org.cn
热超声键合是目前最重要的引线键合技术, 在电子封装领域中有着广泛的应用.
面对封装密度不断提高, 焊点节距不断下降和成本持续降低等挑战, 工程技术人员需要全面了解 …
面对封装密度不断提高, 焊点节距不断下降和成本持续降低等挑战, 工程技术人员需要全面了解 …
A Novel Approach using Finite Element Modeling and Contact Area Parameter for Predicting Wire Bond Shear Strength Non-destructively
Y Long, H He - IEEE Transactions on Components, Packaging …, 2024 - ieeexplore.ieee.org
Wire bonding remains widely utilized in numerous products today due to its mature
technology and cost-effectiveness. However, improper bonding parameters can result in …
technology and cost-effectiveness. However, improper bonding parameters can result in …
The bonding forming simulation and reliability research of the flip-chip stacked gold stud bump
C Huang, W Tang, L Zhang - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
The finite element model of the bonding forming for 3-D flip-chip stacked gold stud bumps
was set up, and the bonding process of stacked gold stud bump was simulated by …
was set up, and the bonding process of stacked gold stud bump was simulated by …
The study on failure mechanisms of bond pad metal peeling: Part A––Experimental investigation
I Jeon, Q Chung - Microelectronics Reliability, 2003 - Elsevier
For the experimental investigation on failure mechanisms of bond pad metal peeling, 31
failed SDRAM chips after the pad peeling are gathered, and SEM and FIB are utilized. From …
failed SDRAM chips after the pad peeling are gathered, and SEM and FIB are utilized. From …
Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging
J Li, L Deng, B Ma, L gang Liu, F Wang, L Han - Microelectronics Reliability, 2011 - Elsevier
It is indicated that the impact and deflection of overhang die during overhang bounding
process results in considerable impact of performance of bonding in this paper. Specifically …
process results in considerable impact of performance of bonding in this paper. Specifically …
Comparison of ultrasonic wire bonding process between gold and copper by nonlinear structure analysis
Y Pan, F Zhu, X Lin, J Fan, S Liu - Journal of Adhesion Science and …, 2018 - Taylor & Francis
Wire bonding is one of the most important processes which connected the chip and lead
frame in microelectronics packaging. Due to the expensive price of gold, copper wire and …
frame in microelectronics packaging. Due to the expensive price of gold, copper wire and …