It is shown that extremely high single-stuck fault coverage is necessary for high-quality
products. Even 100% single-stuck fault coverage may not guarantee adequate quality …

Multichip module technology has been shown to offer significant improvements for
electronics equipment in the areas of miniaturized size, reduced weight, capability for higher …

The use of stuck-at-fault coverage for estimating overall quality levels is examined. Data
from a part tested with both functional and scan tests are analyzed and compared with …

The first built-in self-test feature in a Motorola sidered a" wart" until a RAM test application
recast it as a" feature." Though the BIST approach-an idea conceived as a way to reduce …

A new testability solution is proposed in which externally accessible test points are pre-
designed into cells that comprise the VLSI designs. The test points are accessed through an …

The authors report on an experiment to verify the accuracy of reject ratio predictions by the
available approaches. The data collection effort includes instrumenting the wafer probe test …

Some recent studies show that an at-speed sequential or functional test is better than a test
executed at lower speed. Design-for-testability approaches based on full scan, partial scan …

Presents the history of the microprocessor as told by an active participant. The author looks
at the state of the computer industry before 1970, and how this led into the beginning of …

The Texas Instruments SuperSPARC is a high performance BiCMOS superscalar
microprocessor containing 3.1 M transistors. This paper describes the testability features of …

The Texas Instruments TMS370 is in volume production. Sample manufacturing data has
been collected to correlate stuck fault grades to the defect levels that would have been …