Abstract A three-dimensional (3D) chip stack structure and method of fabricating the
structure thereof are provided. The 3D chip stack structure includes a plurality of vertically …

An electronic device including a printed circuit board (PCB) including a thermal conduction
plane and at least one heat generating component mounted on the PCB and connected to …

US7864825B2 - Method and system for a laser diode bar array assembly - Google Patents
US7864825B2 - Method and system for a laser diode bar array assembly - Google Patents …

The present invention relates to an electronic device for providing improved heat
transporting capability for protecting heat sensitive electronics and a method for producing …

(57) ABSTRACT A chip fabricated from a semiconductor material is dis closed, which may
include active devices located below a first depth from the chip back side, and a structure to …

A device structure includes a printed circuit board (PCB) comprising a thermal conduction
plane, at least one heat generating component thermally connected to the thermal …

A semiconductor device package which includes a semiconductor package, a
semiconductor device joined to the semiconductor package; and a lid to be placed over the …

Thermal management is provided for a device. The device may include a substrate having a
mounting area on a first surface of the substrate. The device may also include first thermal …

An integrated circuit is provided that comprises a resistor, a first superconducting structure
coupled to a first end of the resistor, and a second superconducting structure coupled to a …

To provide a heat sink material that not only is excellent in heat sink properties, but also
allows molded articles of various shapes made of a variety of materials to be used as a base …