MICRO-ELECTRO-MECHANICAL SYSTEM ACOUSTIC SENSOR, MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE STRUCTURE AND METHOD FOR …
US Patent App. 17/488,071, 2022 - freepatentsonline.com
A MEMS acoustic sensor includes a substrate, a back plate, a diaphragm, a dielectric layer
and a connecting portion. The diaphragm is disposed between the substrate and the back …
and a connecting portion. The diaphragm is disposed between the substrate and the back …
Micro-electro-mechanical system acoustic sensor, micro-electro-mechanical system package structure and method for manufacturing the same
HL Ho - US Patent 11,665,485, 2023 - Google Patents
(57) ABSTRACT A MEMS acoustic sensor includes a substrate, a back plate, a diaphragm, a
dielectric layer and a connecting portion. The diaphragm is disposed between the substrate …
dielectric layer and a connecting portion. The diaphragm is disposed between the substrate …