Effect of Ni-RGO nanosheets on the creep behavior of Sn–Ag–Cu composite solder joints

H Zhang, Z Xu, C Guo, B Wu, H Liu, F Li… - Materials Chemistry and …, 2024 - Elsevier
Abstract Creep damage of Sn–Ag–Cu micro-joints is inevitable in service, even at room
temperature. In this study, Ni-decorated reduced graphene oxide (Ni-RGO) nanosheets …

Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approach

VS Ruiz-Jacinto, KS Gutiérrez-Valverde… - Soldering & Surface …, 2023 - emerald.com
Purpose This paper aims to present the novel stacked machine learning approach (SMLA)
to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the …

Combining FEM and Machine Learning Algorithms for Reliability Prediction of Solder Ball Joints in BGA Packages

H Reddad, M Abouelmajd, M Zemzami… - … Computing in Data …, 2024 - ieeexplore.ieee.org
This paper presents a comprehensive approach for reliability assessment of solder ball
joints in Ball Grid Array (BGA) assemblies by combining finite element method (FEM) with …

Reliability Assessment of Solder Ball Joints Using Finite Element Analysis and Machine Learning techniques

H Reddad, M Zemzami, N El Hami… - … on Control, Decision …, 2024 - ieeexplore.ieee.org
This paper presents a comprehensive approach for reliability assessment and optimization
of ball joints by combining finite element analysis (FEA) method with machine learning …