Flexible and stretchable electronics can dramatically enhance the application of electronics
for the emerging Internet of Everything applications where people, processes, data and …

Abstract 4H silicon carbide (4H‐SiC) holds great promise for high‐power and high‐
frequency electronics, in which high‐quality 4H‐SiC wafers with both global and local …

Over the last decade, lasers have been gradually employed for Si wafer dicing to replace
blade dicing. Laser dicing has the potential to replace blade dicing as the future generation …

Pressure sensitive adhesives (PSAs) are utilized for temporary applications since bonding
and debonding are determined by the adhesive-substrate interface and the mechanical and …

The existing stress criterion assumes the material to be isotropic and only distinguishes
elastic, plastic, and crack zones, to explain the scratching-induced sub-surface defects …

We model and realize an ultrasonic contactless pick-and-place device capable of picking,
self-centering, self-orienting, translating, and releasing flat millimetric objects. The device is …

Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in
recent studies of manufacturing development, which can be realized by high-precision …

Natural climbers leverage strong friction and minimal adhesion for effective multidirectional
movement. Toe pads of species like tree frogs display distinct microstructures with …

Remote epitaxy has opened novel opportunities for advanced manufacturing and
heterogeneous integration of two-dimensional (2D) materials and conventional (3D) …

Detachable polymeric adhesives (DPAs) usually exhibit weak environmental reliability due
to the intrinsic reversible network. Herein, such problem is solved by incorporating dynamic …