This paper reports an advanced deep reactive ion etching (DRIE) process for realizing ultra-
deep (500-μm) and ultra-high aspect-ratio (UHAR) silicon structures (AR 40 for 1-mm …

The key optical components of X-ray grating interferometry are gratings, whose profile
requirements play the most critical role in acquiring high quality images. The difficulty of …

Bio-inspired surfaces with superamphiphobic properties are well known as effective
candidates for antifouling technology. However, the limitation of large-area mastering …

Because of its flexibility, when polydimethylsiloxane (PDMS) is fabricated as a biomimetic
antifouling surface, the surface micro-structure is usually vulnerable to structural collapse …

In this work, we propose a new silicon-based micro-fabrication technology to fabricate 3D
high-density high-electrode-count neural micro-probe arrays scalable to thousands and …

The author presents all aspects, in theory and experiments, of nanoelectronic devices
starting from field-effect transistors and leading to alternative device concepts such as …

This paper demonstrates how a single crystal silicon wafer can be used to fabricate thinfilm
piezoelectric-on-silicon (TPoS) resonators by utilizing a modified version of Single Crystal …

A three-dimensional topography simulation of deep reactive ion etching (DRIE) is developed
based on the narrow band level set method for surface evolution and Monte Carlo method …

While there have been many studies using machine learning (ML) algorithms to predict
process outcomes and device performance in semiconductor manufacturing, the extensively …

In this work, the development of engineered silicon substrates for a novel via-middle TSV
integration concept is demonstrated. These substrates include 3D buried etch-stop layers …