We have demonstrated an organic solvent-free water-developable branched sugar resist
material derived from biomass for its use in green electron beam lithography. This …

An electron beam (EB) lithography method using inedible cellulose-based resist material
derived from woody biomass has been successfully developed. This method allows the use …

In the present paper, we describe a novel class of bottom antireflective coating (BARC) and
gap fill materials using dextrin with a-glycoside bonds in a polysaccharide. ArF resist …

High resolution trehalose derivative resist which had specific desired properties was
successfully developed for step and flash nano imprint lithography as one of advanced …

This paper reports an approach using nanoparticle free polymer blends for light scattering
films in liquid crystal displays. The ability to create the regularly structured circle of …

High planarizing gap fill materials based on β-cyclodextrin in ArF photoresist under-layer
materials have been developed for fast etching in CF 4 gas. Gap fill materials used in the via …

Single-molecule imaging revealed the hierarchical mobility change of guest dyes in a
polymer-based thin film under network formation: at the early stage of the reaction, only the …

The via-first dual damascene process is the current manufacturing technology for copper/low-
k interconnect fabrication. In the conventional via-first dual damascene process, metal trench …

The bottom anti-reflective coating (BARC) material can enhance the resolution of the
nanopatterns structures in laser interference lithography process. In this study, WIDE-B ARC …

This study focuses on the characterization of gap fill materials for advanced ArF lithography
process. The gap fill materials have the planarization property on an irregular substrate such …