Curing regime-modulating insulation performance of anhydride-cured epoxy resin: A review

J Li, HH Aung, B Du - Molecules, 2023 - mdpi.com
Anhydride-cured bisphenol-A epoxy resin is widely used in the support, insulation and
sealing key components of electrical and electronic equipment due to their excellent …

Phosphorus-containing active esters modified dicyclopentadiene epoxy resins with simultaneously improved flame retardancy, thermal stability, and dielectric …

Z Fu, Z Ma, J Liu, C Li, C Liu, Q Wang, L Song… - Chemical Engineering …, 2024 - Elsevier
In the pursuit of epoxy thermosets with low dielectric properties and excellent flame
retardancy, the 2-(diphenylphosphino)-1, 4-benzenediol active ester (DPO-HQ-AE). and 10 …

A review of the curing rate and mechanical properties of epoxy resin on polymer matrix composites

M Liang, X Liu, D Liu, X Li, X Hu, C Feng, TT Li… - Journal of Polymer …, 2024 - Springer
The curing rate of epoxy resins is a critical parameter that significantly influences the curing
properties of polymer matrix composites (PMCs). It plays a vital role in meeting high …

Effect of accelerator on properties of epoxy resin re‐prepared from alcoholysis recycling

X Zhao, W Li, X Yang, W Li, F Zou, W Guo… - High …, 2024 - Wiley Online Library
Alcoholysis has emerged as a crucial method for the degradation of anhydride‐cured epoxy
resin, and the degraded epoxy resin (DER) can be reused to prepare a new resin …

[HTML][HTML] Enhanced thermal conductivity and rheological performance of epoxy and liquid crystal epoxy composites with filled Al2O3 compound

F Tian, J Cao, W Ma - Polymer Testing, 2023 - Elsevier
The heat dissipation capability of electrical insulation materials has been the bottleneck
affecting the development of high power density electrical equipment and electronic devices …

Facile Construction of Hyperbranched Polyphenylsiloxane-Modified Epoxy Resins with Excellent Low Dielectric Properties for Electronic Packaging

J Wu, X Liang, L Yu, Y Zhu, Q Zhang… - ACS Applied Polymer …, 2024 - ACS Publications
The booming development of next-generation communication technologies urgently
requires high-performance electronic packaging materials with facile construction. Hereby …

Development of epoxy resin with superior breakdown strength: A Review

L Shengtao, L Mingru - iEnergy, 2024 - ieeexplore.ieee.org
Epoxy resin (EP) has been widely utilized in electrical equipment and electronic devices due
to its fascinating electric, thermal, and mechanical properties. However, the complex …

Characterization of Electrical Tree Degradation of Epoxy Resin under Thermal and Temperature Stresses by Photoelastic Effect

HH Aung, Y Wang, J Li, Y Zhang… - Chinese Journal of …, 2024 - ieeexplore.ieee.org
Epoxy resin is widely used in the support, insulation, and packaging components of
electrical equipment owing to their excellent insulation, thermal, and mechanical properties …

Conductivity and Breakdown Properties of Epoxy Resin for HVDC Bushing by Multifunctional Modifier

X Kong, C Hou, F Li, HS Du… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
In this paper, multifunctional epoxy-based additives of tri-glycidyl para-amino phenol (TGAP)
and 4, 4-tetraglycidyl diamine diphenol methane (TGDDM), with high heat resistance, are …

The Effect of Modifier on Electret Properties and Hardness of Epoxy Composite Material

M Galikhanov, X Zhang, X Ma… - … on Dielectrics and …, 2024 - ieeexplore.ieee.org
The study focuses on the synthesis of thermoelectrets by combining epoxy oligomer, epoxy-
urethane modifier (PEF-3A), and polyaminoamide curing agent (L-20) and the influence of …