[HTML][HTML] Semisolid rheoforming of magnesium alloys: a review

Z Chang, N Su, Y Wu, Q Lan, L Peng, W Ding - Materials & Design, 2020 - Elsevier
A reflection upon the recent developments of semisolid rheoforming techniques of
magnesium (Mg) alloys is vital for successfully shaping the future landscape of lightweight …

Research and development status of in situ field assisted laser additive manufacturing: A review

C Chen, Z Zhang, Y Cai, Y Liu, H Chen - Optics & Laser Technology, 2025 - Elsevier
Laser additive manufacturing (LAM), characterized by its rapid iterative production of
intricate structural products, high flexibility in manufacturing, and excellent stability, caters to …

Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux

H Wang, X Hu, X Jiang, Y Li - Journal of Manufacturing Processes, 2021 - Elsevier
Cu modified carbon nanotubes (Cu-CNTs) doped flux were prepared in this paper, the
influence of the composite flux on the evolution of microstructure and shear strength of Sn …

Effects of In addition on microstructure and properties of SAC305 solder

X Ren, Y Wang, Y Lai, S Shi, X Liu, L Zou… - … of Nonferrous Metals …, 2023 - Elsevier
Abstract In powderswith different contents (0.5− 10 wt.%) were melted into the Sn− 3.0 Ag−
0.5 Cu (SAC305) solder to change the microstructure and thus improve the properties of the …

Effect of ultrasonic vibration on microstructural evolution and mechanical properties of underwater wet welding joint

J Wang, Q Sun, L Wu, Y Liu, J Teng, J Feng - Journal of Materials …, 2017 - Elsevier
The propagation of high-intensity ultrasonic vibration into weld pool can influence on
microstructure and mechanical properties of welded joints. This research introduced a …

[HTML][HTML] Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering

AT Tan, AW Tan, F Yusof - Ultrasonics sonochemistry, 2017 - Elsevier
Techniques to improve solder joint reliability have been the recent research focus in the
electronic packaging industry. In this study, Cu/SAC305/Cu solder joints were fabricated …

Grain refinement of electronic solders: the potential of combining solute with nucleant particles

H Shang, ZL Ma, SA Belyakov, CM Gourlay - Journal of alloys and …, 2017 - Elsevier
Abstract Sn-Ag-Cu electronic solder joints typically solidify from a single nucleation event
producing either a single βSn grain or twinned grains. With so few and variable βSn …

Structural modifications induced by ultrasonic vibration during plasma spray deposition Ni coating on Al substrate

Z Li, Y He, T Liu, B Yang, P Gao, J Wang… - Surface and Coatings …, 2022 - Elsevier
In this study, a 28 kHz ultrasonic vibration was applied to the Al substrate during plasma
spraying of Ni coatings. The microstructure, mechanical properties, and wear resistance of …

Spreading of Sn-Ag-Ti and Sn-Ag-Ti (-Al) solder droplets on the surface of porous graphite through ultrasonic vibration

W Yu, Y Liu, X Liu - Materials & Design, 2018 - Elsevier
The spreading process of an active solder droplet on porous graphite surface was captured
by using high-speed camera. The spreading characteristics of the Sn5Ag8Ti and …

Morphological evolution of semi-solid Mg2Si/AM60 magnesium matrix composite produced by ultrasonic vibration process

H Yan, Y Rao, R He - Journal of Materials Processing Technology, 2014 - Elsevier
The application of ultrasonic vibration treatment (UVT) produced a nearly non-dendritic and
refined semi-solid microstructure of Mg 2 Si/AM60 composite. The effects of UVT …