The cooling or thermal management issues are facing critical challenges with the
continuous miniaturization and rapid increase of heat flux of electronic devices. Significant …

Thermal ground planes (TGPs) are considered to be one the most promising thermal
management devices for cooling the high heat flux miniaturized power electronic devices …

Evaporation plays a critical role in a range of technologies that power and sustain our
society. Wicks are widely used as passive, capillary-fed evaporators, attracting much interest …

For the challenge of cooling hotspots in the burgeoning electronics/optoelectronics
equipment, vapor chambers provide a promising solution based on a distinctive passive two …

Boiling heat transfer is dictated by interfacial phenomena at the three-phase contact line
where vapor bubbles form on the surface. Structured surfaces have shown significant …

This paper reviews recent progress in the development of silicon-based vapor chambers for
heat spreading in electronic packages. Effective hotspot mitigation is an increasingly …

Excessive heat flux of integrated circuits (ICs) leads to the failure of electronic devices and
the consumption of extra energy. Silicon-based loop heat pipe (sLHP) offers a simple …

The trend towards miniaturization and integration of integrated circuits has led to the
emergence of local hotspots with high heat flux and high temperature frequently. Integrating …

Beta-phase gallium oxide (β-Ga 2 O 3), as an ultrawide bandgap semiconductor, is
promising for next generation power and radio frequency electronics. Its low thermal …

Many industrial applications such as electronic cooling and thermal desalination have
adopted the heat dissipation technologies of capillary evaporation and liquid film boiling …