Interest in advanced multifunctional composite materials has generated extensive
discussions on materials endowed with high fire-resistance, mechanical strength, and …

Thermal interface materials (TIMs) with high through-plane thermal conductivity (TC),
softness, and electrical insulation are highly desired for modern electronics. However, it is …

Heat dissipation problem is the primary factor restricting the service life of an electronic
component. The thermal conductivity of materials has become a bottleneck that hinders the …

Extreme environments in aerospace require structural materials to have good heat transfer
properties. Aiming at ultrahigh in-plane thermal conductivity (TC) and mechanical strength …

Polymer composites with high thermal conductivity (TC) as electronic packaging materials
play a critical role in dissipating heat in microelectronic devices. Among the several methods …

Thermal management has become one of the crucial factors in designing electronic
equipment and therefore creating composites with high thermal conductivity is necessary. In …

Laminated composites have been commonly applied to all fields. When made into laminated
composites, Kevlar woven fabrics are able to provide the required functions. In this study …

Janus structure offers materials unique functionalities which are difficult to achieve otherwise
with isotropic counterpart, opening up new avenues in diverse application fields. Here, a …

The carbon fiber reinforced polyetheretherketone (CF/PEEK) composite material can
achieve high efficiency and integrated assembly molding through in-situ consolidation …

Thermal management has become one of the crucial factors in designing electronic
equipment and therefore creating composites with high thermal conductivity is necessary. In …