Reflow recipe establishment based on CFD-Informed machine learning model
This article proposes a computational fluid dynamics (CFD)-based machine learning (ML)
model to set the temperature of a convection reflow oven and control conveyor speed. Due …
model to set the temperature of a convection reflow oven and control conveyor speed. Due …
Warping model of high-power IGBT modules subjected to reflow soldering process
High-power insulated gate bipolar transistor (IGBT) modules are the key devices for energy
change and transmission. Reflow soldering process is a crucial process in IGBT module …
change and transmission. Reflow soldering process is a crucial process in IGBT module …
Shape dependency of fatigue life in solder joints of chip resistors
This study is attempted to correlate between solder joint shape and fatigue life in
experimental and numerical approaches. The test assemblies consisting of R1005 (1.0× 0.5 …
experimental and numerical approaches. The test assemblies consisting of R1005 (1.0× 0.5 …
A deep learning approach for reflow profile prediction
Commercial reflow ovens contain multiple heated zones, which can be individually
controlled for temperature. PCB assemblies travel through each zone at a controlled rate to …
controlled for temperature. PCB assemblies travel through each zone at a controlled rate to …
The optimal solution of reflow oven recipe based on physics-guided machine learning model
This paper presents a physics-guided machine learning model to provide the optimal reflow
recipe for a 7-zone oven. The numerical method based on the computational fluid dynamics …
recipe for a 7-zone oven. The numerical method based on the computational fluid dynamics …
Reflow profiling with the aid of machine learning models
Purpose This paper aims to propose a method to quickly set the heating zone temperatures
and conveyor speed of the reflow oven. This novel approach intensely eases the trial and …
and conveyor speed of the reflow oven. This novel approach intensely eases the trial and …
Optimal thermo-mechanical reliability design of 2.5 D lidless package
2.5 D package has been widely used in electronics packages which using multiple
integrated circuit chips placed on an interposer to increase its capacity and performance …
integrated circuit chips placed on an interposer to increase its capacity and performance …
Reliability of Differently Shaped Solder Joints in Chip Resistor Under Drop Impact
This paper presents a comparative study that demonstrates the influence of solder joint
shapes on the drop test performance of chip resistors. A 77 by 77 mm 2 test board that …
shapes on the drop test performance of chip resistors. A 77 by 77 mm 2 test board that …
ReflowNet: ConvLSTM-based direct reflow oven recipe optimization framework
This paper presents ReflowNet, a domain-adaptive convolutional long short-term memory
(ConvLSTM) neural network-based oven recipe optimization framework for reflow soldering …
(ConvLSTM) neural network-based oven recipe optimization framework for reflow soldering …
Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV)
This study investigated the impact of an adhesion layer on Through Glass Via (TGV)
samples and studied the creep behavior of copper TGVs. TGV samples with and without an …
samples and studied the creep behavior of copper TGVs. TGV samples with and without an …